Home » Intel Manuals » Processors » Intel BX80580Q9400 » Manual Viewer

Intel BX80580Q9400 User Manual - Page 66

Intel® High Definition Audio, Interposer, Card Mott Canyon 4 Not Included

UPC - 735858203074

Add to My Manuals
Save this manual to your list of manuals

Page 66 highlights

Figure 16. AUX Pull-Down Rework Add-In Cards A.4 The resistors are: • Port B: R5C9 and R5C5 • Port C: R5B5 and R5B4 • Port D: R2C1 and R2C2 Intel® High Definition Audio Interposer Card (Mott Canyon 4) (Not Included) The Mott Canyon 4 (MC4) Interposer Card is provided to enable Intel® High Definition Audio (Intel® HD Audio) and modem functionality on the development board. Mott Canyon 4 provides two 30-pin MDC1.0 connectors and one 12-pin MDC1.5 connector, supporting up to two Intel HD Audio codecs simultaneously. The Interposer plugs into any PCI Express or PCI slot for mechanical stability and is electrically connected to the platform via a 2x13 ribbon cable from the Mott Canyon 4 card to a 2x8 header (J8E1) and 2x4 header (J8E2). Headers on Mott Canyon 4 are provided for both modem and audio sideband signals. MC4 provides four audio jacks and one modem jack. A set of four more audio jacks may be added by using the MC4 paddle card. MC4 paddle card also provides one jack each for S/PDIF IN and S/PDIF OUT. For additional information see page 27 of the schematics. A diagram of the MC4 interposer and paddle card on a platform is shown in Figure 17. 66 Development Kit User's Manual

Section	Page
Intel® CoreTM 2 Duo Processor and Intel® GS45 Express Chipset (with DDR3 System Memory)	1
Contents	3
Revision History	7
1 About This Manual	8
1.1 Content Overview	8
1.2 Text Conventions	9
1.3 Glossary of Terms and Acronyms	10
1.4 Development Kit Technical Support	14
1.4.1 Online Support	14
1.4.2 Additional Technical Support	14
1.5 Related Documents	15
1.5.1 Ordering Hard Copies of Documents	15
2 Getting Started	17
2.1 Overview	17
2.2 Development Kit Contents	17
2.3 Additional Required Hardware (Not Included in the Development Kit)	18
2.4 Additional Required Software (Not included in the Development Kit)	19
2.5 Workspace Preparation	20
2.6 System Setup and Power-Up	21
2.6.1 Using the AC to DC Power Supply (Mobile Power Mode)	22
2.7 Power Down	23
2.8 System BIOS	23
2.8.1 Configuring the BIOS	23
2.8.2 Programming BIOS Using a Bootable USB Device	24
3 Development Board Features	26
3.1 Block Diagram	26
3.2 Mechanical Form Factor	26
3.3 Development Board Key Features	26
3.4 Software Key Features	30
3.4.1 AMI BIOS	30
3.5 Thermal Management	31
3.6 System Features and Operation	31
3.6.1 Processor Support	31
3.6.2 Processor Voltage Regulators	32
3.6.3 Front-Side Bus (FSB)	32
3.6.4 Processor Power Management	32
3.6.5 Processor Active Cooling	32
3.6.6 Manual Processor Voltage ID (VID) Support	32
3.6.7 Chipset	33
3.6.8 System Memory	33
3.6.9 Video Display	34
3.6.10 PCIe Slots	34
3.6.11 PCI Slots	35
3.6.12 On-Board LAN	35
3.6.13 Serial Peripheral Interface (SPI)	36
3.6.14 Soft Audio/Soft Modem	36
3.6.15 SATA Storage	36
3.6.16 USB Connectors	37
3.6.17 LPC Super I/O (SIO)/LPC Slot	38
3.6.18 Serial, IrDA	38
3.6.19 Intel® 82802 Firmware Hub Device Support	38
3.6.20 System Management Controller (SMC)/Keyboard Controller (KBC)	39
3.6.21 Clocks	39
3.6.22 Real Time Clock	39
3.6.23 Thermal Monitoring	39
3.6.24 Power Supply Solution	40
3.6.25 Manual VID support for Graphics VR	40
3.6.26 Debug Interfaces	41
3.6.27 Board Form-Factor	41
3.7 Power Management	41
3.7.1 Power Management States	41
3.8 Testability	42
3.9 Power Measurement Support	42
3.10 Power Supply Usage and Recommendation	47
4 Development Board Physical Reference	48
4.1 Board Components	48
4.2 Connectors	51
4.2.1 Back Panel Connectors	51
4.3 Configuration Settings	53
4.3.1 Configuration Jumpers/Switches	53
4.3.2 BSEL Jumper Settings	56
4.4 Power and Reset Push Buttons	56
4.5 Net Detect Button	57
4.6 LEDs	58
4.7 Other Headers	59
4.7.1 H8 Programming Headers	59
4.7.2 Sideband and Test Headers	60
Appendix A Add-In Cards	61
A.1 Port 80-83 Add-in Card (Included)	61
A.2 PCI Expansion Card (Thimble Peak 2) (Included)	62
A.3 HDMI and Display Port Video Interface Add-In Card (Eaglemont) (Included)	62
A.3.1 Rework to change Eaglemont Card from HDMI to Display Port	63
A.3.2 AUX Pull Down Rework.	65
A.4 Intel® High Definition Audio Interposer Card (Mott Canyon 4) (Not Included)	66
A.4.1 Mott Canyon 4 Jumper Settings	67
A.5 ExpressCard Module Interposer (Duck Bay 3) (Not Included)	69
A.6 PCI Express mini card Interposer (Upham IV) (Not Included)	70
A.7 Docking Connector Card (Saddlestring II) (Not Included)	71
Appendix B Rework Instructions	74
B.1 Internal HDMI Enabling	74
B.2 Enabling the Integrated Trusted Platform Module (iTPM)	74
B.3 Enabling External HDMI	75
B.4 Support for Upham 4	75
B.5 Low Voltage High-Definition (HD) Audio Rework	75
Appendix C Programming System BIOS Using a Flash Programming Device	77

Match case Limit results 1 per page

Add-In Cards

Development Kit User’s Manual

Figure 16. AUX Pull-Down Rework

The resistors are:

•

Port B: R5C9 and R5C5

•

Port C: R5B5 and R5B4

•

Port D: R2C1 and R2C2

A.4

Intel® High Definition Audio

Interposer

Card (Mott Canyon 4) (Not Included)

The Mott Canyon 4 (MC4) Interposer Card is provided to enable Intel® High Definition

Audio (Intel® HD Audio) and modem functionality on the development board.

Mott

Canyon 4 provides two 30-pin MDC1.0 connectors and one 12-pin MDC1.5 connector,

supporting up to two Intel HD Audio codecs simultaneously. The Interposer plugs into

any PCI Express or PCI slot for mechanical stability and is electrically connected to the

platform via a 2x13 ribbon cable from the Mott Canyon 4 card to a 2x8 header (J8E1)

and 2x4 header (J8E2). Headers on Mott Canyon 4 are provided for both modem and

audio sideband signals. MC4 provides four audio jacks and one modem jack. A set of

four more audio jacks may be added by using the MC4 paddle card. MC4 paddle card

also provides one jack each for S/PDIF IN and S/PDIF OUT. For additional information

see page 27 of the

schematics. A diagram of the MC4 interposer and paddle card on a

platform is shown in Figure 17.