Intel BX80580Q9400 User Manual - Page 42

Testability, Power Measurement Support

Page 42 highlights

Development Board Features Table 13. System Power Management M-States M States System States Power Wells DRAM M0 S0 All wells powered Powered ME Clocking Clock chip powered and PLL, DLL in use M1 M-off S3-S5 S3-S5 Main well down Main well down In self refresh; ME DRAM controller on using Channel A Powered off (or self refresh) Clock Chip powered with only the GMCH clock running and PLL, DLL in use None, ME powered off The development board also supports CLKRUN#. 3.8 Testability The development board provides an Extended Debug Port (XDP) for testing at J1F1 and direct processor probing. The XDP interface is backwards compatible with the older ITP interface as well. The user must use an XDP or ITP interface that is compatible with the Intel® Core™ 2 Duo processor SL9400 and SU9400 Note: The XDP interface is backwards compatible with the ITP interface. However, an XDP to ITP converter cable is necessary to use the older ITP tools. Also, in some cases a resistor change rework is necessary to get the older ITP tools to function properly. Please contact your Intel representative for additional details. 3.9 Power Measurement Support Power measurement resistors are provided on the platform to measure the power of most subsystems. All power measurement resistors have a tolerance of 1%. The value of these power measurement resistors are 2mΩ by default. Power on a particular subsystem is calculated using the following formula: P=V2 R R = value of the sense resistor (typically 0.002Ω) V = the voltage difference measured across the sense resistor. It is recommended that the user use a high precision digital multi-meter tool such as the Agilent 34401A digital multi-meter. Refer to Table 14 for a comparison of a high 2 precision digital multi-meter (Agilent 34401A) versus a standard precision digital multi-meter (Fluke 79). 42 Development Kit User's Manual

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Development Board Features
42
Development Kit User’s Manual
Table 13. System Power Management M-States
M States
System
States
Power Wells
DRAM
ME Clocking
M0
S0
All wells powered
Powered
Clock chip powered and PLL, DLL in use
M1
S3-S5
Main well down
In self refresh; ME
DRAM controller on
using Channel A
Clock Chip powered with only the GMCH
clock running and PLL, DLL in use
M-off
S3-S5
Main well down
Powered off (or self
refresh)
None, ME powered off
The development board also supports CLKRUN#.
3.8
Testability
The development board provides an Extended Debug Port (XDP) for testing at J1F1
and direct processor probing. The XDP interface is backwards compatible with the
older ITP interface as well. The user must use an XDP or ITP interface that is
compatible with the Intel® Core™ 2 Duo processor SL9400 and SU9400
Note:
The XDP interface is backwards compatible with the ITP interface. However, an XDP to
ITP converter cable is necessary to use the older ITP tools. Also, in some cases a
resistor change rework is necessary to get the older ITP tools to function properly.
Please contact your Intel representative for additional details.
3.9
Power Measurement Support
Power measurement resistors are provided on the platform to measure the power of
most subsystems. All power measurement resistors have a tolerance of 1%. The value
of these power measurement resistors are 2m
by default. Power on a particular
subsystem is calculated using the following formula:
R
V
P
2
=
R = value of the sense resistor (typically 0.002
)
V = the voltage difference measured across the sense resistor.
It is recommended that the user use a high precision digital multi-meter tool such as
the Agilent 34401A digital multi-meter. Refer to
2
Table 14
for a comparison of a high
precision digital multi-meter (Agilent 34401A) versus a standard precision digital
multi-meter (Fluke 79).