Intel S1200BT Technical Product Specification - Page 32

Functional Architecture Intel® Server Board S1200BT TPS  Converts any available power and thermal headroom into a higher frequency on active cores.  At nominal marked processor frequency, many applications consume less than the rated processor power draw.  Availability is independent of the number of active cores.  Maximum Turbo Boost frequency depends on the number of active cores and varies by processor configuration.  The amount of time the system spends in Intel® Turbo Boost operation depends on workload, operating environment, and platform design. If the processor supports the Intel® Turbo Boost Technology feature, the BIOS Setup provides an option to enable or disable this feature. The default state is "enabled". 3.2 Memory Subsystem The Intel® Xeon® Processor E3-1200 series or Intel® Core™ Processor i3 series have an Integrated Memory Controller (IMC) in its package. Each processor produces up to two DDR3 channels of memory. Each DDR3 channel in the IMC supports up to two UDIMM slots. The DDR3 UDIMM frequency can be 1066/1333 (for Intel® Xeon® E3-1200 Processors or the 2nd Generation Intel® Core™ i3 Processors) and 1333/1600 (for Intel® Xeon® E3-1200 V2 Processors or the 3nd Generation Intel® Core™ i3 Processors) MHz. Only ECC memory is supported on this platform.  The memory channels are named as "Channel A" and "Channel B".  The memory slots are named as "Slot1" and "Slot2" on each channel. Slot1will be the farthest from the processor socket.  DIMMs are named to reflect the channel and slot in which they are installed: o Channel A, Slot1 is "DIMM_A1". o Channel A, Slot2 is "DIMM_A2". o Channel B, Slot1 is "DIMM_B1". o Channel B, Slot2 is "DIMM_B2". 3.2.1 Memory Supported The Intel® Server Board S1200BT family supports various DDR3 DIMM modules of different types and sizes and speeds. In this section, the statements of support are subject to qualification in two ways: For S1200 Server Boards with an SNB-DT processor, the Server Board and the BIOS may support:  DIMMs composed of Dynamic Random Access Memory (DRAM) chips using 1 Gb, 2 Gb, or 4 Gb technology  DIMMs using x8 DRAM technology only  DIMMs organized as Single Rank (SR) or Dual Rank (DR)  DIMM sizes of 1 GB, 2 GB, 4 GB, or 8 GB 20 Revision 2.0 Intel order number G13326-004