IBM 8649 Hardware Maintenance Manual - Page 70
microprocessor
UPC - 000435133427
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12. Install the heat sink on the microprocessor. Thermal grease Heat sink a. Remove the plastic cover from the bottom of the heat sink. b. Align and place the heat sink on top of the microprocessor, grease side down, in the retention bracket. Press firmly on the heat sink. Attention: Alternate the tightening of the two captive screws to prevent damage to the microprocessor. Ensure that the screws are completely tightened (until they stop); otherwise, damage to the microprocessor will occur. c. Secure the heat sink to the microprocessor by tightening the captive screws. Alternate between the two captive screws in the heat sink while tightening them. 13. Install the air baffle. 14. Install the adapter airflow guide: a. Rotate the front and rear adapter-retention brackets to the open (unlocked) position. b. Slide the adapter airflow guide into the guides on the air baffle and front adapter-support bracket; then, push it into place, using care to not damage any cables. c. Rotate the front and rear adapter-retention brackets to the closed (locked) position. 15. If you have other options to install or remove, do so now. 16. Replace the support bracket (see "Removing and installing the support bracket" on page 38). 17. Replace the side cover (see "Replacing the bezel" on page 66). 18. Reconnect the external cables and power cords. Turn on the attached devices, and turn on the server. 60 IBM xSeries 225 Types 8649: Hardware Maintenance Manual and Troubleshooting Guide