Intel E5472 Data Sheet - Page 103

103

Boxed Processor Specifications

8

Boxed Processor Specifications

8.1

Introduction

Intel boxed processors are intended for system integrators who build systems from

components available through distribution channels. The Quad-Core Intel® Xeon®

Processor 5400 Series will be offered as an Intel boxed processor.

Intel will offer the Quad-Core Intel® Xeon® Processor 5400 Series with two heat sink

configurations available for each processor frequency: 1U passive/3U+ active

combination solution and a 2U passive only solution. The 1U passive/3U+ active

combination solution is based on a 1U passive heat sink with a removable fan that will

be pre-attached at shipping. This heat sink solution is intended to be used as either a

1U passive heat sink, or a 3U+ active heat sink. Although the active combination

solution with removable fan mechanically fits into a 2U keepout, its use is not

recommended in that configuration.

Quad-Core Intel® Xeon® Processor X5400 Series will include a copper 1U passive/3U+

active combination solution or a copper 2U passive heatsink. Quad-Core Intel® Xeon®

Processor E5400 Series and Quad-Core Intel® Xeon® Processor L5400 Series with

80W and lower TDPs will include an aluminum extruded 1U passive/3U+ active

combination solution or an aluminum extruded 2U passive heatsink.

The 1U passive/3U+ active combination solution in the active fan configuration is

primarily designed to be used in a pedestal chassis where sufficient air inlet space is

present and strong side directional airflow is not an issue. The 1U passive/3U+ active

combination solution with the fan removed and the 2U passive thermal solution require

the use of chassis ducting and are targeted for use in rack mount or pedestal servers.

The retention solution used for these products is called the Common Enabling Kit, or

CEK. The CEK base is compatible with both thermal solutions and uses the same hole

locations as the Intel

®

Xeon

®

processor with 800 MHz system bus.

The 1U passive/3U+ active combination solution will utilize a removable fan capable of

4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active

thermal solution helps customers meet acoustic targets in pedestal platforms through

the motherboards’s ability to directly control the RPM of the processor heat sink fan.

See

Section 8.3

for more details on fan speed control, and see

Section 6.3

for more on

the PWM and PECI interface along with Digital Thermal Sensors (DTS).

Figure 8-1

through

Figure 8-3

are representations of the two heat sink solutions.

Section	Page
Quad-Core Intel® Xeon® Processor 5400 Series	1
1 Introduction	9
1.1 Terminology	10
1.2 State of Data	13
1.3 References	13
2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.4.2 PLL Power Supply	18
2.5 Voltage Identification (VID)	18
2.6 Reserved, Unused, and Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	38
2.13.3 Die Voltage Validation	39
2.14 AGTL+ FSB Specifications	39
3 Mechanical Specifications	43
3.1 Package Mechanical Drawings	43
3.2 Processor Component Keepout Zones	47
3.3 Package Loading Specifications	47
3.4 Package Handling Guidelines	48
3.5 Package Insertion Specifications	48
3.6 Processor Mass Specifications	48
3.7 Processor Materials	48
3.8 Processor Markings	48
3.9 Processor Land Coordinates	49
4 Land Listing	51
4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments	51
4.1.1 Land Listing by Land Name	51
4.1.2 Land Listing by Land Number	61
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	90
6.2 Processor Thermal Features	90
6.2.1 Intel® Thermal Monitor Features	90
6.2.2 On-Demand Mode	92
6.2.3 PROCHOT# Signal	93
6.2.4 FORCEPR# Signal	93
6.2.5 THERMTRIP# Signal	94
6.3 Platform Environment Control Interface (PECI)	94
6.3.1 Introduction	94
6.3.2 PECI Specifications	96
7 Features	97
7.1 Power-On Configuration Options	97
7.2 Clock Control and Low Power States	97
7.2.1 Normal State	98
7.2.2 HALT or Extended HALT State	98
7.2.3 Stop-Grant State	100
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	101
7.3 Enhanced Intel SpeedStep® Technology	101
8 Boxed Processor Specifications	103
8.1 Introduction	103
8.2 Mechanical Specifications	105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	105
8.2.2 Boxed Processor Heat Sink Weight	113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	113
8.3 Electrical Requirements	113
8.3.1 Fan Power Supply (Active CEK)	113
8.3.2 Boxed Processor Cooling Requirements	114
8.4 Boxed Processor Contents	115
9 Debug Tools Specifications	117
9.1 Debug Port System Requirements	117
9.2 Target System Implementation	117
9.2.1 System Implementation	117
9.3 Logic Analyzer Interface (LAI)	117
9.3.1 Mechanical Considerations	118

Intel E5472 Data Sheet - Page 103

Boxed Processor Specifications

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