Intel E5472 Data Sheet - Page 114
Boxed Processor Cooling Requirements
UPC - 735858200684
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Boxed Processor Specifications The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 177.8 mm [7 in.] from the center of the processor socket. Table 8-1. PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution Description PWM Control Frequency Range Min Frequency 21,000 Nominal Frequency 25,000 Max Frequency 28,000 Unit Hz Table 8-2. Fan Specifications for 4-Pin Active CEK Thermal Solution Description +12 V: 12 volt fan power supply IC: Fan Current Draw Min 10.8 N/A Typ Steady 12 1 Max Steady 12 1.25 Max Startup 13.2 1.5 SENSE: SENSE frequency 2 2 2 2 Unit V A Pulses per fan revolution Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Table 8-3. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Pin Number 1 2 3 4 Signal Ground Power: (+12 V) Sense: 2 pulses per revolution Control: 21 KHz-28 KHz Color Black Yellow Green Blue 8.3.2 Boxed Processor Cooling Requirements As previously stated the boxed processor will be available in two product configurations. Each configuration will require unique design considerations. Meeting the processor's temperature specifications is also the function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specifications are found in Chapter 6 of this document. 8.3.2.1 1U Passive/3U+ Active Combination Heat Sink Solution (1U Rack Passive) In the 1U configuration it is assumed that a chassis duct will be implemented to provide a minimum airflow of 15 cfm at 0.38 in. H2O (25.5 m3/hr at 94.6 Pa) of flow impedance. The duct should be carefully designed to minimize the airflow bypass 114