Intel E5472 Data Sheet - Page 88
Table 6-9., Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile Table, Table 6-10., Quad-
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Thermal Specifications Table 6-9. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile Table Power (W) 0 5 10 15 20 25 30 35 40 45 50 TCASE_MAX (°C) 42.1 43.6 45.1 46.6 48.1 49.6 51.0 52.5 54.0 55.5 57.0 Table 6-10. Quad-Core Intel® Xeon® Processor L5408 Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 40 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-5; Table 6-11 Notes 1, 2, 3, 4, 5 Notes: 1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the loadline specifications in Section 2.13. 2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated with characterized data from silicon measurements in a future release of this document. 4. Power specifications are defined at all VIDs found in Table 2-12. The Quad-Core Intel® Xeon® Processor L5408 may be shipped under multiple VIDs for each frequency. 5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. 88