Intel E5472 Data Sheet - Page 79

79

Thermal Specifications

6


6.1

Package Thermal Specifications

The Quad-Core Intel® Xeon® Processor 5400 Series requires a thermal solution to

maintain temperatures within its operating limits. Any attempt to operate the processor

outside these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes,

thermal management becomes increasingly crucial when building computer systems.

Maintaining the proper thermal environment is key to reliable, long-term system

operation.

A complete solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks

attached to the processor integrated heat spreader (IHS). Typical system level thermal

solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For

more information on designing a component level thermal solution, refer to the

Quad-

Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines

(TMDG).

Note:

The boxed processor will ship with a component thermal solution. Refer to

Chapter 8

for details on the boxed processor.

6.1.1


To allow the optimal operation and long-term reliability of Intel processor-based

systems, the processor must remain within the minimum and maximum case

temperature (TCASE) specifications as defined by the applicable thermal profile (see

Table 6-1

and

Figure 6-1

for the Quad-Core Intel® Xeon® Processor X5482,

Table 6-3

and

Figure 6-2

for the Quad-Core Intel® Xeon® Processor X5400 Series,

Table 6-6

and

Figure 6-3

for the Quad-Core Intel® Xeon® Processor E5400 Series,

Table 6-8

and

Figure 6-4

for the Quad-Core Intel® Xeon® Processor L5400 Series and

Table 6-11

and

Figure 6-5

for the Quad-Core Intel® Xeon® Processor L5408. Thermal solutions

not designed to provide this level of thermal capability may affect the long-term

reliability of the processor and system. For more details on thermal solution design,

please refer to the

Quad-Core Intel® Xeon® Processor 5400 Series

Thermal/Mechanical Design Guidelines (TMDG) or Quad-Core Intel® Xeon® Processor

L5408 Series in Embedded Applications Thermal/Mechanical Design Guidelines (TMDG)

.

The Quad-Core Intel® Xeon® Processor 5400 Series implements a methodology for

managing processor temperatures which is intended to support acoustic noise

reduction through fan speed control and to assure processor reliability. Selection of the

appropriate fan speed is based on the relative temperature data reported by the

processor’s Platform Environment Control Interface (PECI) bus as described in

Section 6.3

. If the value reported via PECI is less than T

CONTROL

, then the case

temperature is permitted to exceed the Thermal Profile. If the value reported via PECI

is greater than or equal to T

CONTROL

, then the processor case temperature must remain

at or below the temperature as specified by the thermal profile. The temperature

reported over PECI is always a negative value and represents a delta below the onset of

thermal control circuit (TCC) activation, as indicated by PROCHOT# (see

Section 6.2

,

Section	Page
Quad-Core Intel® Xeon® Processor 5400 Series	1
1 Introduction	9
1.1 Terminology	10
1.2 State of Data	13
1.3 References	13
2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.4.2 PLL Power Supply	18
2.5 Voltage Identification (VID)	18
2.6 Reserved, Unused, and Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	38
2.13.3 Die Voltage Validation	39
2.14 AGTL+ FSB Specifications	39
3 Mechanical Specifications	43
3.1 Package Mechanical Drawings	43
3.2 Processor Component Keepout Zones	47
3.3 Package Loading Specifications	47
3.4 Package Handling Guidelines	48
3.5 Package Insertion Specifications	48
3.6 Processor Mass Specifications	48
3.7 Processor Materials	48
3.8 Processor Markings	48
3.9 Processor Land Coordinates	49
4 Land Listing	51
4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments	51
4.1.1 Land Listing by Land Name	51
4.1.2 Land Listing by Land Number	61
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	90
6.2 Processor Thermal Features	90
6.2.1 Intel® Thermal Monitor Features	90
6.2.2 On-Demand Mode	92
6.2.3 PROCHOT# Signal	93
6.2.4 FORCEPR# Signal	93
6.2.5 THERMTRIP# Signal	94
6.3 Platform Environment Control Interface (PECI)	94
6.3.1 Introduction	94
6.3.2 PECI Specifications	96
7 Features	97
7.1 Power-On Configuration Options	97
7.2 Clock Control and Low Power States	97
7.2.1 Normal State	98
7.2.2 HALT or Extended HALT State	98
7.2.3 Stop-Grant State	100
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	101
7.3 Enhanced Intel SpeedStep® Technology	101
8 Boxed Processor Specifications	103
8.1 Introduction	103
8.2 Mechanical Specifications	105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	105
8.2.2 Boxed Processor Heat Sink Weight	113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	113
8.3 Electrical Requirements	113
8.3.1 Fan Power Supply (Active CEK)	113
8.3.2 Boxed Processor Cooling Requirements	114
8.4 Boxed Processor Contents	115
9 Debug Tools Specifications	117
9.1 Debug Port System Requirements	117
9.2 Target System Implementation	117
9.2.1 System Implementation	117
9.3 Logic Analyzer Interface (LAI)	117
9.3.1 Mechanical Considerations	118

Intel E5472 Data Sheet - Page 79

Package Thermal Specifications

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