Intel E5472 Data Sheet - Page 89

Thermal Profile

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Thermal Specifications Figure 6-5. Quad-Core Intel® Xeon® Processor L5408 Thermal Profile Thermal Profile 90 Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 80 hours per year Tcase [C] 70 Short-Term Thermal Profile 60 Tc = 0.678 * P + 60 Nominal Thermal Profile Tc = 0.678 * P + 45 50 40 0 5 10 15 20 25 30 35 40 Power [W] Notes: 1. Please refer to Table 6-11 for discrete points that constitute the thermal profile. 2. Implementation of the Quad-Core Intel® Xeon® Processor L5408 Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation). 3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance. 4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year, as compliant with NEBS Level 3. 5. Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-Term Thermal Profile for a duration longer than the limits specified in Note 4 above, do not meet the processor's thermal specifications and may result in permanent damage to the processor. 6. Refer to the Quad-Core Intel® Xeon® Processor L5408 Series in Embedded Applications Thermal/Mechanical Design Guidelines (TMDG) for system and environmental implementation details. Table 6-11. Quad-Core Intel® Xeon® Processor L5408 Thermal Profile Table Power (W) 0 5 10 15 20 25 30 35 40 Nominal TCASE_MAX (°C) 45 48 52 55 59 62 65 69 72 Short-term TCASE_MAX (°C) 60 63 67 70 74 77 80 84 87 89

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89
Thermal Specifications
Notes:
1.
Please refer to
Table 6-11
for discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor L5408
Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
(See
Section 6.2
for details on TCC activation).
3.
The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4.
The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3.
5.
Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the limits specified in Note 4 above, do not meet the
processor’s thermal specifications and may result in permanent damage to the processor.
6.
Refer to the
Quad-Core Intel® Xeon® Processor L5408 Series in Embedded Applications
Thermal/Mechanical Design Guidelines (TMDG)
for system and environmental implementation details.
Figure 6-5.
Quad-Core Intel® Xeon® Processor L5408 Thermal Profile
Thermal Profile
40
50
60
70
80
90
0
5
10
15
20
25
30
35
40
Power [W]
Tcase [C]
Short-Term Thermal Profile
Tc = 0.678 * P + 60
Nominal Thermal Profile
Tc = 0.678 * P + 45
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed 360
hours per year
Table 6-11.
Quad-Core Intel® Xeon® Processor L5408 Thermal Profile Table
Power (W)
Nominal T
CASE_MAX
(
°
C)
Short-term T
CASE_MAX
(
°
C)
0
45
60
5
48
63
10
52
67
15
55
70
20
59
74
25
62
77
30
65
80
35
69
84
40
72
87