Intel E5472 Data Sheet - Page 48

Mechanical Specifications 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on a package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Shear Tensile Torque Maximum Recommended 311 70 111 25 3.95 35 Units N lbf N lbf N-m LBF-in Notes 1,4,5 2,4,5 3,4,5 Notes: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. 2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. 3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. 4. These guidelines are based on limited testing for design characterization and incidental applications (one time only). 5. Handling guidelines are for the package only and do not include the limits of the processor socket. 3.5 Package Insertion Specifications The Quad-Core Intel® Xeon® Processor 5400 Series can be inserted and removed 15 times from an LGA771 socket, which meets the criteria outlined in the LGA771 Socket Design Guidelines. 3.6 Processor Mass Specifications The typical mass of the Quad-Core Intel® Xeon® Processor 5400 Series is 21.5 grams [0.76 oz.]. This includes all components which make up the entire processor product. 3.7 Processor Materials The Quad-Core Intel® Xeon® Processor 5400 Series is assembled from several components. The basic material properties are described in Table 3-3. Table 3-3. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel over copper Fiber-reinforced resin Gold over nickel 3.8 Processor Markings Figure 3-5 shows the topside markings on the processor. This diagram aids in the identification of the Quad-Core Intel® Xeon® Processor 5400 Series. 48