Intel E5472 Data Sheet - Page 11

11

Commonly used terms are explained here for clarification:

•

Quad-Core Intel® Xeon® Processor 5400 Series

- Intel 64-bit microprocessor

intended for dual processor servers and workstations based on Intel’s 45

nanometer process, in the PC-LGA 771 package with four processor cores. For this

document “processors” is used as the generic term for the “Quad-Core Intel®

Xeon® Processor 5400 Series”. The term ‘processors’ and “Quad-Core Intel®

Xeon® Processor 5400 Series” are inclusive of Quad-Core Intel® Xeon® Processor

X5482, Quad-Core Intel® Xeon® Processor X5400 Series, Quad-Core Intel®

Xeon® Processor E5400 Series, and Quad-Core Intel® Xeon® Processor L5400

Series.

•

Quad-Core Intel® Xeon® Processor X5492

– An ultra performance version of

the Quad-Core Intel® Xeon® Processor 5400 Series. For this document “Quad-

Core Intel® Xeon® Processor X5492” is used to call out specifications that are

unique to the Quad-Core Intel® Xeon® Processor X5492 SKU.

•

Quad-Core Intel® Xeon® Processor X5482

– An ultra performance version of

the Quad-Core Intel® Xeon® Processor 5400 Series. For this document “Quad-

Core Intel® Xeon® Processor X5482” is used to call out specifications that are

unique to the Quad-Core Intel® Xeon® Processor X5482 SKU. E-step version of

the X5482 falls into the X5400 family specifications

•

Quad-Core Intel® Xeon® Processor X5400 Series

- An accelerated

performance version of the Quad-Core Intel® Xeon® Processor X5400 Series. For

this document “Quad-Core Intel® Xeon® Processor X5400 Series” is used to call

out specifications that are unique to the Quad-Core Intel® Xeon® Processor X5400

Series SKU.

•

Quad-Core Intel® Xeon® Processor E5400 Series

– A mainstream

performance version of the Quad-Core Intel® Xeon® Processor X5400 Series. For

this document “Quad-Core Intel® Xeon® Processor E5400 Series” is used to call

out specifications that are unique to the Quad-Core Intel® Xeon® Processor E5400

Series SKU.

•

Quad-Core Intel® Xeon® Processor L5400 Series

- Intel 64-bit

microprocessor intended for dual processor server blades and embedded servers.

The Quad-Core Intel® Xeon® Processor L5400 Series is a lower voltage and lower

power version of the Quad-Core Intel® Xeon® Processor 5400 Series. For this

document “Quad-Core Intel® Xeon® Processor L5400 Series” is used to call out

specifications that are unique to the Quad-Core Intel® Xeon® Processor L5400

Series SKU.

•

Quad-Core Intel® Xeon® Processor L5408

- Intel 64-bit microprocessor

intended for dual processor server blades and embedded servers. The Quad-Core

Intel® Xeon® Processor L5408 is a lower voltage and lower power version of the

Quad-Core Intel® Xeon® Processor 5400 Series supporting higher case

temperatures. It supports a Thermal Profile with nominal and short-term conditions

designed to meet Network Equipment Building System (NEBS) level 3 compliance.

For this document “Quad-Core Intel® Xeon® Processor L5408” is used to call out

specifications that are unique to the Quad-Core Intel® Xeon® Processor L5408

SKU.

•

FC-LGA (Flip Chip Land Grid Array) Package

– The Quad-Core Intel® Xeon®

Processor 5400 Series package is a Land Grid Array, consisting of a processor core

mounted on a pinless substrate with 771 lands, and includes an integrated heat

spreader (IHS).

•

LGA771 socket

– The Quad-Core Intel® Xeon® Processor 5400 Series interfaces

to the baseboard through this surface mount, 771 Land socket. See the

LGA771

Socket Design Guidelines

for details regarding this socket.

Section	Page
Quad-Core Intel® Xeon® Processor 5400 Series	1
1 Introduction	9
1.1 Terminology	10
1.2 State of Data	13
1.3 References	13
2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.4.2 PLL Power Supply	18
2.5 Voltage Identification (VID)	18
2.6 Reserved, Unused, and Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	38
2.13.3 Die Voltage Validation	39
2.14 AGTL+ FSB Specifications	39
3 Mechanical Specifications	43
3.1 Package Mechanical Drawings	43
3.2 Processor Component Keepout Zones	47
3.3 Package Loading Specifications	47
3.4 Package Handling Guidelines	48
3.5 Package Insertion Specifications	48
3.6 Processor Mass Specifications	48
3.7 Processor Materials	48
3.8 Processor Markings	48
3.9 Processor Land Coordinates	49
4 Land Listing	51
4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments	51
4.1.1 Land Listing by Land Name	51
4.1.2 Land Listing by Land Number	61
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	90
6.2 Processor Thermal Features	90
6.2.1 Intel® Thermal Monitor Features	90
6.2.2 On-Demand Mode	92
6.2.3 PROCHOT# Signal	93
6.2.4 FORCEPR# Signal	93
6.2.5 THERMTRIP# Signal	94
6.3 Platform Environment Control Interface (PECI)	94
6.3.1 Introduction	94
6.3.2 PECI Specifications	96
7 Features	97
7.1 Power-On Configuration Options	97
7.2 Clock Control and Low Power States	97
7.2.1 Normal State	98
7.2.2 HALT or Extended HALT State	98
7.2.3 Stop-Grant State	100
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	101
7.3 Enhanced Intel SpeedStep® Technology	101
8 Boxed Processor Specifications	103
8.1 Introduction	103
8.2 Mechanical Specifications	105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	105
8.2.2 Boxed Processor Heat Sink Weight	113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	113
8.3 Electrical Requirements	113
8.3.1 Fan Power Supply (Active CEK)	113
8.3.2 Boxed Processor Cooling Requirements	114
8.4 Boxed Processor Contents	115
9 Debug Tools Specifications	117
9.1 Debug Port System Requirements	117
9.2 Target System Implementation	117
9.2.1 System Implementation	117
9.3 Logic Analyzer Interface (LAI)	117
9.3.1 Mechanical Considerations	118

Intel E5472 Data Sheet - Page 11

FC-LGA Flip Chip Land Grid Array Package - socket

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