Home » Intel Manuals » Processors » Intel QX9770 » Manual Viewer

Intel QX9770 Design Guidelines - Page 107

Legacy Fan Speed Control, Consult

UPC - 735858197564

Add to My Manuals
Save this manual to your list of manuals

Page 107 highlights

Legacy Fan Speed Control spike smoothing). Please select the lowest setting available close to 4.0 seconds by the fan speed control device 4. The Fan Speed Controller, or Health Monitor Component, takes the result of the two fan speed ramps (processor and system) and drives the TMA fan to the highest resulting PWM duty cycle (%) 5. For BTX systems a second thermal sensor is recommended to capture chassis ambient for more detail see Appendix F. 6. To ensure compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed control these setting should not be user configurable. 7. If this function is present on the device it must be enabled Note: The fan speed component vendors provide libraries that are used by the BIOS writer to program the component registers with the parameters listed above. Consult the appropriate vendor datasheet for detailed information on programming their component. § Thermal and Mechanical Design Guidelines 107

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Match case Limit results 1 per page

Legacy Fan Speed Control

Thermal and Mechanical Design Guidelines

107

spike smoothing). Please select the lowest setting available close to 4.0 seconds by the

fan speed control device

The Fan Speed Controller, or Health Monitor Component, takes the result of the two fan

speed ramps (processor and system) and drives the TMA fan to the highest resulting

PWM duty cycle (%)

For BTX systems a second thermal sensor is recommended to capture chassis ambient

for more detail see

Appendix F.

To ensure compliance with the thermal specification, thermal profile and usage of the

SENSOR

for fan speed control these setting should not be user configurable.

If this function is present on the device it must be enabled

Note:

The fan speed component vendors provide libraries that are used by the BIOS writer

to program the component registers with the parameters listed above.

Consult the

appropriate vendor datasheet for detailed information on programming their

component.