Intel QX9770 Design Guidelines - Page 90
View Through Lens at Solder Station, Moving Solder back onto Thermocouple Bead
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Page 90 highlights
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 47 and Figure 48) Figure 47. View Through Lens at Solder Station Figure 48. Moving Solder back onto Thermocouple Bead 90 Thermal and Mechanical Design Guidelines
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Case Temperature Reference Metrology
90
Thermal and Mechanical Design Guidelines
24.
You may need to move the solder back toward the groove as the IHS begins to
heat.
Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure 47 and Figure 48)
Figure 47. View Through Lens at Solder Station
Figure 48. Moving Solder back onto Thermocouple Bead