Intel QX9770 Design Guidelines - Page 92
Thermocouple placed into groove, Removing Excess Solder
UPC - 735858197564
View all Intel QX9770 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 92 highlights
Figure 50. Thermocouple placed into groove Case Temperature Reference Metrology 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 51). Figure 51. Removing Excess Solder Note: Take usual precautions when using open blades 30. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 92 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology
92
Thermal and Mechanical Design Guidelines
Figure 50. Thermocouple placed into groove
29.
Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure 51).
Figure 51. Removing Excess Solder
Note:
Take usual precautions when using open blades
30.
Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.