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Intel QX9770 Design Guidelines - Page 55

Socket and Voltage Regulation Cooling Strategy

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Intel Thermal/Mechanical Reference Design Information 5.7 Socket and Voltage Regulation Cooling Strategy Consideration for the cooling of power delivery components and CPU socket needs to be addressed when using a remote heat exchanger. The use of a remote heat exchanger for processor cooling can remove the cooling air that the motherboard components around the socket need and traditionally get from an active heatsink directly attached to the processor IHS. The Intel ALCT Reference Design incorporates a voltage regulation and socket cooling scheme that eliminates the need for additional fan(s) on these components. The proximity of the remote heat exchanger on the rear panel of the ATX miniTower /Tower allows for direct impingement of airflow to the voltage regulation components. Figure 19 illustrates how a small gap or exit between the fan's pressure side and the heat exchanger inlet that is integrated into the heat exchanger design allows for air to be introduced directly to the VR region for cooling. This approach introduces an airflow path that doesn't significantly impact the airflow through the heat exchanger due to the reduced total impedance the fan sees and the subsequent increase in the operating point of the fan. Effectively the fan operating point increase is near the flow that is delivered to the VR and socket. Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling Feature HX Fan Built-in VR and Socket cooling feature I/O VR HS Pump/coldplate Socket This method of VR and socket cooling was validated by testing this configuration as well as not having a gap. Analysis indicates that the momentum component attributed with the pressurized airflow in the configuration shown in Figure 19 would help the cooling flow penetrated the VR components down to the MB surface thus providing the best thermal performance. Thermal and Mechanical Design Guidelines 55

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

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Intel Thermal/Mechanical Reference Design Information

Thermal and Mechanical Design Guidelines

5.7

Socket and Voltage Regulation Cooling Strategy

Consideration for the cooling of power delivery components and CPU socket needs to

be addressed when using a remote heat exchanger.

The use of a remote heat

exchanger for processor cooling can remove the cooling air that the motherboard

components around the socket need and traditionally get from an active heatsink

directly attached to the processor IHS.

The Intel ALCT Reference Design incorporates

a voltage regulation and socket cooling scheme that eliminates the need for additional

fan(s) on these components.

The proximity of the remote heat exchanger on the rear

panel of the ATX miniTower /Tower allows for direct impingement of airflow to the

voltage regulation components.

Figure 19 illustrates how a small gap or exit between

the fan’s pressure side and the heat exchanger inlet that is integrated into the heat

exchanger design allows for air to be introduced directly to the VR region for cooling.

This approach introduces an airflow path that doesn’t significantly impact the airflow

through the heat exchanger due to the reduced total impedance the fan sees and the

subsequent increase in the operating point of the fan.

Effectively the fan operating

point increase is near the flow that is delivered to the VR and socket.

Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling

Feature

This method of VR and socket cooling was validated by testing this configuration as

well as not having a gap.

Analysis indicates that the momentum component

attributed with the pressurized airflow in the configuration shown in Figure 19 would

help the cooling flow penetrated the VR components down to the MB surface thus

providing the best thermal performance.

Pump/coldplate

Fan

I/O

Socket

Built-in VR and Socket

cooling feature

VR HS