Intel QX9770 Design Guidelines - Page 39

Intel Thermal/Mechanical Reference Design Information

Thermal and Mechanical Design Guidelines

39

5

Intel Thermal/Mechanical

Reference Design Information

The Intel Advanced Liquid Cooling Technology or ALCT is composed of three

components: a liquid to air radiator type heat exchanger; a 12 0mm fan; and an

integrated pump with cold plate. The heat exchanger is connected to the pump with

flexible hoses.

The heart of the design is the integrated pump cold plate combination. The cold plate

is nested within a centrifugal pump impeller. This unique design takes advantage of

the radial pull of the impeller to provide a uniform flow across the cold plate. The inlet

flow returning from the heat exchanger impinges on the center of the cold plate. The

centrifugal impeller then pulls the fluid across and through the cold plate fins. The fins

in turn act as an inducer for the impeller. The fluid is then accelerated through the

impeller and collected in a double involute and returned to the exchanger.

There are several unique features of the design in addition to the integration of pump

and cold plate. There are no dynamic seals in the pump. The impeller is an integral

part of the motor and is directly driven through a magnetic couple. There are no seals

between the upper and lower pump housings. The seal is a function of the molding

process. The copper cold plate is molded into the lower housing. The metal to plastic

seal is also a function of the molding process.

The unit is maintenance free. Through careful selection of materials and the unique

heat exchanger design that contains a reservoir the units are sealed for life. In

addition every unit is proof pressure tested, vacuum decay tested, helium leak

checked and the motor RPM is verified.

5.1

Validation Results for the ATX Reference Design

The reference thermal solution is a liquid cooled design, with an integrated pump and

cold-plate (or chiller) and a remote heat exchanger with an attached fan. This solution

is called the Intel Advanced Liquid Cooling Technology Reference Design (Intel ALCT

Reference Design).

The reference solution pump and cold-plate module is compliant with the reference

ATX motherboard keep-out and height recommendations defined Section

5.5 through

the tubing that carries the working fluid from the pump/cold-plate protrudes through

this keep-out and the heat exchanger is located on the back panel of the chassis.

The solution comes as an integrated assembly. The major ALCT components are

provided Figure 16.

Note:

If this fan design is used in your product and you will deliver it to end use customers,

you have the responsibility to determine an adequate level of protection (e.g.,

protection barriers, a cage, or an interlock) against contact with the energized fan by

the user during user servicing.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 39

Intel Thermal/Mechanical Reference Design Information

Page 39 highlights