Intel QX9770 Design Guidelines - Page 82
Thermocouple Attach Procedure, D.5.1, Thermocouple Conditioning and Preparation
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Case Temperature Reference Metrology D.5 Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 - 155°C. Note: To avoid damage to the TTV or processor ensure the IHS temperature does not exceed 155 °C. D.5.1 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Sections D.2 and D.3. 2. Under a microscope verify the thermocouple insulation meets the quality requirements. The insulation should be about 1/16 inch (0.062 ± 0.030) from the end of the bead (Figure 35). Figure 35. Inspection of Insulation on Thermocouple 3. Measure the thermocouple resistance by holding both contacts on the connector on one probe and the tip of thermocouple to the other probe of the DMM (measurement should be about~3.0 ohms for 36-gauge type T thermocouple). 4. Straighten the wire for about 38 mm [1 ½ inch] from the bead. 82 Thermal and Mechanical Design Guidelines