Intel QX9770 Design Guidelines - Page 44
Environmental Reliability Testing, 5.2.1.1 Random Vibration Test Procedure
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LGA775 Socket Heatsink Loading 5.2 Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 5.2.1.1 Random Vibration Test Procedure Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 11. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 44 Thermal and Mechanical Design Guidelines