Intel QX9770 Design Guidelines - Page 52

LGA775 Socket Heatsink Loading

52

Thermal and Mechanical Design Guidelines

5.3

Material and Recycling Requirements

Material shall be resistant to fungal growth.

Examples of non-resistant materials

include cellulose materials, animal and vegetable based adhesives, grease, oils, and

many hydrocarbons.

Synthetic materials such as PVC formulations, certain

polyurethane compositions (e.g., polyester and some polyethers), plastics which

contain organic fillers of laminating materials, paints, and varnishes also are

susceptible to fungal growth.

If materials are not fungal growth resistant, then MIL-

STD-810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams must be recyclable per the European Blue

Angel recycling standards.

5.4

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units

that meet the safety standards:

•

UL Recognition-approved for flammability at the system level.

All mechanical and

thermal enabling components must be a minimum UL94V-2 approved.

•

CSA Certification.

All mechanical and thermal enabling components must have

CSA certification.

•

All components (in particular the heatsink fins) must meet the test requirements

of UL1439 for sharp edges.

•

If the International Accessibility Probe specified in IEC 950 can access the moving

parts of the fan, consider adding safety feature so that there is no risk of personal

injury.

5.5

Geometric Envelope for Intel Reference ATX

Thermal Mechanical Design

Figure 66, Figure 67, and Figure 68 in

Appendix G gives detailed reference ATX/

μ

ATX

motherboard keep-out information for the reference thermal/mechanical enabling

design. These drawings include height restrictions in the enabling component region.

The maximum height of the reference solution above the motherboard is 71.12 mm

[2.8 inches] except for the flexible hoses which transit the area to the heat exchanger

which is mounted on the back panel, and is compliant with the motherboard primary

side height constraints defined in the

ATX Specification revision 2.2

and the

microATX

Motherboard Interface Specification revision 1.2

found at

http://www.formfactors.org

.

Figure 16 shows the Intel

®

ALCT Reference Design Major Components. The reference

solution also requires suitable space to mount the heat exchanger fan combination on

the back panel. Figure 17 gives the required foot print on the back panel.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 52

Material and Recycling Requirements, 5.4 Safety Requirements

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