Intel QX9770 Design Guidelines - Page 69

Heatsink Clip Load Metrology

Thermal and Mechanical Design Guidelines

69

Appendix B

Heatsink Clip Load

Metrology

B.1

Overview

This section describes a procedure for measuring the load applied by the heatsink

assembly on a processor package.

This procedure is recommended to verify the preload is within the design target range

for a design, and in different situations. For example:

•

Heatsink preload for the LGA775 socket

•

Quantify preload degradation under bake conditions.

Note:

This document reflects the current metrology used by Intel. Intel is continuously

exploring new ways to improve metrology. Updates will be provided later as this

document is revised as appropriate.

B.2

Test Preparation

B.2.1

Heatsink Preparation

Three load cells are assembled into the base of the heatsink under test, in the area

interfacing with the processor Integrated Heat Spreader (IHS), using load cells

equivalent to those listed in Section

B.2.2.

To install the load cells, machine a pocket in the heatsink base, as shown Figure 28

and Figure 29. The load cells should be distributed evenly, as close as possible to the

pocket walls. Apply wax around the circumference of each load cell and the surface of

the pocket around each cell to maintain the load cells in place during the heatsink

installation on the processor and motherboard (Refer to Figure 29).

The depth of the pocket depends on the height of the load cell used for the test. It is

necessary that the load cells protrude out of the heatsink base. However, this

protrusion should be kept minimal, as it will create additional load by artificially

raising the heatsink base. The measurement offset depends on the whole assembly

stiffness (i.e. motherboard, clip, etc.). Figure 30 shows an example using the

Heatsink.

Note:

When optimizing the heatsink pocket depth, the variation of the load cell height

should also be taken into account to make sure that all load cells protrude equally

from the heatsink base. It may be useful to screen the load cells prior to installation to

minimize variation.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 69

Appendix B, Heatsink Clip Load, Metrology, Overview, Test Preparation

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