Intel QX9770 Design Guidelines - Page 49
The Assembly Cumulative Mass Loss Data in Continuous Operation Test - vs
UPC - 735858197564
View all Intel QX9770 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 49 highlights
Intel Thermal/Mechanical Reference Design Information Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation Test at 50 ºC and 1450 RPM Cumulative mass loss (grams) 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 Week Pump-1 Pump-2 Pump-3 8 The reservoir presence in assembly and its impact on thermal performance was also confirmed by drawing the liquid out in the increment of 5 mL and measuring thermal performance at each increment. The Thermal resistance data are shown in Figure 14. It can be seen that when the liquid of 65 mL or more is drawn, thermal resistance goes up significantly. The test verifies the role of reservoir in maintaining thermal performance with liquid loss up to the reservoir size of 38 mL and 27 mL beyond that. Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir Theta ca [C/W] Theta ca vs. fluid level 1.200 1.000 0.800 0.600 0.400 0.200 0.000 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Fluid Removed [ml] Pump-1 Pump 3 Pump 2 Thermal and Mechanical Design Guidelines 49