Intel QX9770 Design Guidelines - Page 4

Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel - motherboards

Page 4 highlights

LGA775 Socket Heatsink Loading 4.2.8 4.2.9 4.2.10 4.2.11 THERMTRIP# Signal 36 Cooling System Failure Warning 36 Digital Thermal Sensor 37 Platform Environmental Control Interface (PECI 38 5 Intel Thermal/Mechanical Reference Design Information 39 5.1 Validation Results for the ATX Reference Design 39 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 Heatsink Performance 40 Acoustics 40 Altitude 41 Reference Heatsink Thermal Validation 41 Fan Motor Performance 42 Pump Motor Performance 43 5.2 Environmental Reliability Testing 44 5.2.1 5.2.2 5.2.3 5.2.4 Structural Reliability Testing 44 5.2.1.1 Random Vibration Test Procedure 44 5.2.1.2 Shock Test Procedure 45 Power Cycling 46 Reliability Testing 46 5.2.3.1 Tubing Material Selection 48 5.2.3.2 Reservoir Sizing 48 5.2.3.3 Reliability Test Results 50 Recommended BIOS/CPU/Memory Test Procedures 51 5.3 Material and Recycling Requirements 52 5.4 Safety Requirements 52 5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......52 5.6 Reference Attach Mechanism 54 5.7 Socket and Voltage Regulation Cooling Strategy 55 6 Intel® Quiet System Technology (Intel® QST 57 6.1 Intel® Quiet System Technology Algorithm 57 6.1.1 Output Weighting Matrix 58 6.1.2 Proportional-Integral-Derivative (PID 58 6.2 Board and System Implementation of Intel® Quiet System Technology .......60 6.3 Intel® QST Configuration & Tuning 62 6.4 Fan Hub Thermistor and Intel® QST 62 Appendix A LGA775 Socket Heatsink Loading 63 A.1 LGA775 Socket Heatsink Considerations 63 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 64 A.2.1 Heatsink Preload Requirement Limitations 64 A.2.2 Motherboard Deflection Metric Definition 64 A.2.3 Board Deflection Limits 66 A.2.4 Board Deflection Metric Implementation Example 66 A.2.5 Additional Considerations 67 A.2.5.1 Motherboard Stiffening Considerations 68 A.3 Heatsink Selection Guidelines 68 Appendix B Heatsink Clip Load Metrology 69 B.1 Overview 69 B.2 Test Preparation 69 4 Thermal and Mechanical Design Guidelines

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LGA775 Socket Heatsink Loading
4
Thermal and Mechanical Design Guidelines
4.2.8
THERMTRIP# Signal
.................................................................
36
4.2.9
Cooling System Failure Warning
................................................
36
4.2.10
Digital Thermal Sensor
.............................................................
37
4.2.11
Platform Environmental Control Interface (PECI)
..........................
38
5
Intel Thermal/Mechanical Reference Design Information
.......................................
39
5.1
Validation Results for the ATX Reference Design
.......................................
39
5.1.1
Heatsink Performance
..............................................................
40
5.1.2
Acoustics
...............................................................................
40
5.1.3
Altitude
..................................................................................
41
5.1.4
Reference Heatsink Thermal Validation
.......................................
41
5.1.5
Fan Motor Performance
............................................................
42
5.1.6
Pump Motor Performance
.........................................................
43
5.2
Environmental Reliability Testing
............................................................
44
5.2.1
Structural Reliability Testing
.....................................................
44
5.2.1.1
Random Vibration Test Procedure
................................
44
5.2.1.2
Shock Test Procedure
................................................
45
5.2.2
Power Cycling
.........................................................................
46
5.2.3
Reliability Testing
....................................................................
46
5.2.3.1
Tubing Material Selection
...........................................
48
5.2.3.2
Reservoir Sizing
.......................................................
48
5.2.3.3
Reliability Test Results
...............................................
50
5.2.4
Recommended BIOS/CPU/Memory Test Procedures
......................
51
5.3
Material and Recycling Requirements
......................................................
52
5.4
Safety Requirements
............................................................................
52
5.5
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
......
52
5.6
Reference Attach Mechanism
..................................................................
54
5.7
Socket and Voltage Regulation Cooling Strategy
.......................................
55
6
Intel
®
Quiet System Technology (Intel
®
QST)
.....................................................
57
6.1
Intel
®
Quiet System Technology Algorithm
...............................................
57
6.1.1
Output Weighting Matrix
..........................................................
58
6.1.2
Proportional-Integral-Derivative (PID)
........................................
58
6.2
Board and System Implementation of
Intel
®
Quiet System Technology
.......
60
6.3
Intel
®
QST Configuration & Tuning
..........................................................
62
6.4
Fan Hub Thermistor and Intel
®
QST
........................................................
62
Appendix A
LGA775 Socket Heatsink Loading
......................................................................
63
A.1
LGA775 Socket Heatsink Considerations
..................................................
63
A.2
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
®
Reference Design
.................................................................................
64
A.2.1
Heatsink Preload Requirement Limitations
...................................
64
A.2.2
Motherboard Deflection Metric Definition
.....................................
64
A.2.3
Board Deflection Limits
............................................................
66
A.2.4
Board Deflection Metric Implementation Example
.........................
66
A.2.5
Additional Considerations
.........................................................
67
A.2.5.1
Motherboard Stiffening Considerations
.........................
68
A.3
Heatsink Selection Guidelines
.................................................................
68
Appendix B
Heatsink Clip Load Metrology
............................................................................
69
B.1
Overview
............................................................................................
69
B.2
Test Preparation
...................................................................................
69