Intel QX9770 Design Guidelines - Page 51
Recommended BIOS/CPU/Memory Test Procedures, Table 8. Reliability Test Results
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Intel Thermal/Mechanical Reference Design Information Table 8. Reliability Test Results Use Condition Continuous Operation Test Conditions TLIQUID = 75 ºC for 16 weeks TLIQUID = 50 ºC TLIQUID = 50 ºC TLIQUID = 50 ºC On-off Cycles TLIQUID = 35-60 ºC, 5500 cycles TLIQUID = 35-60 ºC, 5500 cycles TLIQUID = 35-60 ºC, 7500 cycles Failure mechanism Results 1 0/10 failure 2 0.25-0.30 grams/week 3 Insignificant change in Ψca for 3 samples 4 2% average RPM degradation after 8 weeks for 3 samples 1 0/3 failure 2 3 grams loss after all cycles for 3 samples 4 No RPM degradation for 0/3 samples 5.2.4 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has not been exposed to any battery of tests prior to the test being considered. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • Keyboard • Monitor The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Thermal and Mechanical Design Guidelines 51