Intel Q9450 Design Guidelines - Page 106
ATX/μATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
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Mechanical Drawings Figure 60. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components Sheet 3 8 THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI D 1 7 ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2.50 45 X 3.50 27.25 37.00 32.85 A 3.00 3.00 120.0 1.00 30.00 3.80 8.15 2 LEVER MOTION SPACE REQUIRED TO RELEASE ( 46.11 ) SOCKET LOAD PLATE B 5.80 3 DWG. NO C40819 SHT. 3 REV 3 1 ( 37.60 ) 14.60 6.60 SOCKET HOUSING 1 D CAVITY (CPU PACKAGE) ( 16.87 ) LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLACE (FARSIDE) ( 16.00 ) C SOCKET BALL 1 ( 55.58 ) B 5.80 SECTION A-A 3.80 NOTES: 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS). A 2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION. IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES AND DEFLECTION / SHAPE CHANGES DUE TO DSL LOAD. 3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME. 8 7 6 5 TOP SIDE VIEW 4 DEPARTMENT TMD 3 A BOTTOM SIDE VIEW R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 2 SIZE CAGE CODE D SCALE: NONE DRAWING NUMBER C40819 DO NOT SCALE DRAWING SHEET 3 OF 1 REV 3 3 106 Thermal and Mechanical Design Guidelines