Intel Q9450 Design Guidelines - Page 22

Processor Thermal/Mechanical Information

22

Thermal and Mechanical Design Guidelines

For ATX platforms using the Intel

®

Core™2 Quad processor Q6000 series at 95 W, an

active air-cooled design, assumed be used in ATX Chassis, with a fan installed at the

top of the heatsink equivalent to the D60188-001 reference design (see Chapter

5)

should be designed to manage the processor TDP at an inlet temperature of

35 ºC + 5 ºC = 40 ºC.

The slope of the thermal profile was established assuming a generational

improvement in thermal solution performance of the Intel reference design. For an

example of Intel

®

Core™2 Extreme quad-core processor QX6000 series at the

775_VR_CONFIG_05B Intel

®

Core™2 Extreme quad-core processor QX6700 in an ATX

platform, its improvement is about 15% over the Intel reference design (RCFH-4).

This performance is expressed as the slope on the thermal profile and can be thought

of as the thermal resistance of the heatsink attached to the processor,



CA

(Refer to

Section

3.1). The intercept on the thermal profile assumes a maximum ambient

operating condition that is consistent with the available chassis solutions.

For Balanced Technology Extended (BTX) platforms, a front-to-back cooling design

equivalent to Intel BTX TMA Type I reference design (see the document of

Balanced

Technology Extended (BTX) System Design Guide

) should be designed to manage the

processor TDP at an inlet temperature of 35 ºC + 0.5 ºC = 35.5 ºC.

The thermal profiles for the processor Intel

®

Core™2 Extreme quad-core processor

QX6000 series at the 775_VR_CONFIG_05B are defined such that a single thermal

solution (e.g., RCFH-4 or BTX TMA Type I reference design) can be used for all

775_VR_CONFIG_05B processors (TDP = 130 W). See Chapter

5 for a discussion of

the RCFH-4.

To determine compliance to the thermal profile, a measurement of the actual

processor power dissipation is required. The measured power is plotted on the

Thermal Profile to determine the maximum case temperature. Using the example in

Figure 3 for the Intel

®

Core™2 Extreme quad-core processor QX6000 series at the

775_VR_CONFIG_05B dissipating 110 W the maximum case temperature is 61.1 °C.

See the datasheet for the thermal profile.

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9450 Design Guidelines - Page 22

VR_CONFIG_05B processors TDP = 130 W. See - core 2 quad processor

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