Intel Q9450 Design Guidelines - Page 27

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

27

2.4

System Thermal Solution Considerations

2.4.1

Chassis Thermal Design Capabilities

The Intel reference thermal solutions and Intel

®

Boxed Processor thermal solutions

assume that the chassis delivers a maximum T

A

at the inlet of the processor fan

heatsink. The following tables show the T

A

requirements for the reference solutions

and Intel

®

Boxed Processor thermal solutions.

Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions

Type

ATX

D60188-001

ATX

RCBFH-

3

ATX

RCFH-4

BTX

Type I

Heatsink Inlet

Temperature

40 °C

40 °C

39 °C

35.5 °C

NOTE:

1.

Intel reference designs (D60188-001 and RCBFH-3) are assumed be used in the chassis

where expected the temperature rise is 5 °C.

2.

Intel reference design (RCFH-4) is assumed be used in the thermally advantaged

chassis and expected some of the temperature rise is induced by processor heat

recirculation (refer to

Thermally Advantaged Chassis version 1.1

for Thermally

Advantaged Chassis thermal and mechanical requirements).

Table 2. Heatsink Inlet Temperature of Intel

®

Boxed Processor thermal solutions

Type

Boxed Processor Heatsink for

Intel

®

Core™2 Extreme quad-core processor QX6000 series at

the 775_VR_CONFIG_05B,

Intel

®

Core™2 Quad processor Q6000 series,

Intel

®

Core™2 Extreme processor QX9000 series, and

Intel

®

Core™2 Quad processor Q9000 and Q8000 series

Heatsink Inlet

Temperature

39 °C

NOTE:

1.

Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged

chassis (refer to

Thermally Advantaged Chassis version 1.1

for Thermally Advantaged

Chassis thermal and mechanical requirements).

2.4.2

Improving Chassis Thermal Performance

The heat generated by components within the chassis must be removed to provide an

adequate operating environment for both the processor and other system

components. Moving air through the chassis brings in air from the external ambient

environment and transports the heat generated by the processor and other system

components out of the system. The number, size and relative position of fans and

vents determine the chassis thermal performance, and the resulting ambient

temperature around the processor. The size and type (passive or active) of the

thermal solution and the amount of system airflow can be traded off against each

other to meet specific system design constraints. Additional constraints are board

layout, spacing, component placement, acoustic requirements and structural

considerations that limit the thermal solution size. For more information, refer to the

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9450 Design Guidelines - Page 27

System Thermal Solution Considerations

Page 27 highlights