Intel Q9450 Design Guidelines - Page 7

System Airflow Illustration with System Monitor Point Area Identified - motherboards

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Page 7 highlights

Figure 52. Application of Accelerant 95 Figure 53. Removing Excess Adhesive from IHS 95 Figure 54. Finished Thermocouple Installation 96 Figure 55. Thermocouple Wire Management 97 Figure 56. System Airflow Illustration with System Monitor Point Area Identified .... 100 Figure 57. Thermal Sensor Location Illustration 101 Figure 58. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 104 Figure 59. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2 105 Figure 60. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 106 Figure 61. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 1 107 Figure 62. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 2 108 Figure 63. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 3 109 Figure 64. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 4 110 Figure 65. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Sheet 5 111 Figure 66. ATX Reference Clip - Sheet 1 112 Figure 67. ATX Reference Clip - Sheet 2 113 Figure 68. Reference Fastener - Sheet 1 114 Figure 69. Reference Fastener - Sheet 2 115 Figure 70. Reference Fastener - Sheet 3 116 Figure 71. Reference Fastener - Sheet 4 117 Figure 72. Intel® RCFH4 Reference Solution Assembly 118 Figure 73. Intel® RCFH4 Reference Solution Assembly - Page 2 119 Figure 74. Intel® D60188-001 Reference Solution Assembly 120 Figure 75. Intel® D60188-001 Reference Solution Heatsink 121 Thermal and Mechanical Design Guidelines 7

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Thermal and Mechanical Design Guidelines
7
Figure 52. Application of Accelerant
...................................................................
95
Figure 53. Removing Excess Adhesive from IHS
..................................................
95
Figure 54. Finished Thermocouple Installation
.....................................................
96
Figure 55. Thermocouple Wire Management
........................................................
97
Figure 56. System Airflow Illustration with System Monitor Point Area Identified
....
100
Figure 57. Thermal Sensor Location Illustration
.................................................
101
Figure 58. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1
..................................
104
Figure 59. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2
..................................
105
Figure 60. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3
..................................
106
Figure 61. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 1
......................................................................
107
Figure 62. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 2
......................................................................
108
Figure 63. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 3
......................................................................
109
Figure 64. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 4
......................................................................
110
Figure 65. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 5
......................................................................
111
Figure 66. ATX Reference Clip – Sheet 1
...........................................................
112
Figure 67. ATX Reference Clip - Sheet 2
...........................................................
113
Figure 68. Reference Fastener - Sheet 1
...........................................................
114
Figure 69. Reference Fastener - Sheet 2
...........................................................
115
Figure 70. Reference Fastener - Sheet 3
...........................................................
116
Figure 71. Reference Fastener - Sheet 4
...........................................................
117
Figure 72. Intel
®
RCFH4 Reference Solution Assembly
........................................
118
Figure 73. Intel
®
RCFH4 Reference Solution Assembly - Page 2
...........................
119
Figure 74. Intel
®
D60188-001 Reference Solution Assembly
................................
120
Figure 75. Intel
®
D60188-001 Reference Solution Heatsink
.................................
121