Intel Q9450 Design Guidelines - Page 29
Thermal Metrology
UPC - 735858198493
View all Intel Q9450 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 29 highlights
Thermal Metrology 3 Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the "thermal characterization parameter", ("psi") will be used. 3.1 Characterizing Cooling Performance Requirements The idea of a "thermal characterization parameter", ("psi"), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (same heat source and local ambient conditions). The thermal characterization parameter is calculated using total package power. Note: Heat transfer is a three-dimensional phenomenon that can rarely be accurately and easily modeled by a single resistance parameter like . The case-to-local ambient thermal characterization parameter value (CA) is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of °C/W: CA = (TC - TA) / PD (Equation 1) Where: CA TC TA PD = Case-to-local ambient thermal characterization parameter (°C/W) = Processor case temperature (°C) = Local ambient temperature in chassis at processor (°C) = Processor total power dissipation (W) (assumes all power dissipates through the IHS) Thermal and Mechanical Design Guidelines 29