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Intel Q9450 Design Guidelines - Page 9

Revision History - q9550

UPC - 735858198493

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Revision History Revision Number -001  Initial Release. Description -002 -003 -004 -005 -006 -007 -008 -009 -010 -011 -012 -013  Added specifications for Intel® Core™2 Quad Processor Q6600  Updated QX6800 series at the 775_VR_CONFIG_05B thermal information  Updated Q6000 series at 105 W thermal information  Updated TC attach procedure for the new groove direction  Added Q6000 series at 95 W thermal information  Added D60188-001 reference design  Added Q6600 at 95 W.  Added QX6800  Added Intel® Core™2 Extreme processor QX9650  Removed Legacy Fan Speed Control appendix.  Added Intel® Core™2 Quad processors Q9550, Q9450, and Q9300  Added Intel® Core™2 Quad processors Q9650 and Q9400  Added Intel® Core™2 Quad processors Q8200  Added Intel® Core™2 Quad processors Q8300  Added Intel® Core™2 Quad processor Q9000S and Q8000s series - Q9550S, Q9400S, and Q8200S  Added Intel® Core™2 Quad processor Q8400 and Q8400S  Added Intel® Core™2 Quad processor Q9505 and Q9505S Date November 2006 January 2007 July 2007 July 2007 August 2007 November 2007 January 2008 August 2008 August 2008 December 2008 January 2008 April 2009 August 2009 § Thermal and Mechanical Design Guidelines 9

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

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Thermal and Mechanical Design Guidelines

Revision History

Revision

Number

Description

Date

-001



Initial Release.

November

2006

-002



Added specifications for Intel

Core™2 Quad Processor

Q6600

January 2007

-003



Updated QX6800 series at the 775_VR_CONFIG_05B

thermal information



Updated Q6000 series at 105 W thermal information



Updated TC attach procedure for the new groove direction



Added Q6000 series at 95 W thermal information



Added D60188-001 reference design

July 2007

-004



Added Q6600 at 95 W.

July 2007

-005



Added QX6800

August 2007

-006



Added Intel

Core™2 Extreme processor QX9650



Removed Legacy Fan Speed Control appendix.

November

2007

-007



Added Intel

Core™2 Quad processors Q9550, Q9450, and

Q9300

January 2008

-008



Added Intel

Core™2 Quad processors Q9650 and Q9400

August 2008

-009



Added Intel

Core™2 Quad processors Q8200

August 2008

-010



Added Intel

Core™2 Quad processors Q8300

December 2008

-011



Added Intel

Core™2 Quad processor Q9000S

and Q8000s

series – Q9550S, Q9400S, and Q8200S

January 2008

-012



Added Intel

Core™2 Quad processor Q8400 and Q8400S

April 2009

-013



Added Intel

Core™2 Quad processor Q9505 and Q9505S

August 2009