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Intel Q9450 Design Guidelines - Page 96

Thermocouple Wire Management

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Case Temperature Reference Metrology 33. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 53). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft. This will help to keep the adhesive surface flat and smooth with no pits or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a second time. 34. Clean IHS surface with IPA and a wipe. 35. Clean the LGA pads with IPA and a wipe. 36. Replace the land side cover on the device. 37. Perform a final continuity test. 38. Wind the thermocouple wire into loops and secure or if provided by the vendor back onto the plastic roll (see Figure 54). Figure 54. Finished Thermocouple Installation 39. Place the device in a tray or bag until it's ready to be used for thermal testing use. D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as shown in Figure 55. This will keep the wire from getting damaged or pinched when removing and installing the heatsink. Note: When thermocouple wires are damaged, the resulting reading maybe wrong. For example, if there are any cuts into the wires insulation where the wires are pinched between the heatsink and the socket lid when installing the heatsink, the thermocouple wires can get in contact at this location. In that case, the reported temperature would be the point of the heatsink/socket lid area. This temperature is usually much lower than the temperature at the center of the IHS. Prior to installing the heatsink, make sure that the thermocouple wires remain below the IHS top surface, by running a flat blade on top of the IHS for example. 96 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Match case Limit results 1 per page

Case Temperature Reference Metrology

Thermal and Mechanical Design Guidelines

33.

Using a blade, carefully shave any adhesive that is above the IHS surface

(see Figure 53). The preferred method is to shave from the edge to the center of

the IHS.

Note:

The adhesive shaving step should be performed while the adhesive is partially cured,

but still soft. This will help to keep the adhesive surface flat and smooth with no pits

or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a

second time.

34.

Clean IHS surface with IPA and a wipe.

35.

Clean the LGA pads with IPA and a wipe.

36.

Replace the land side cover on the device.

37.

Perform a final continuity test.

38.

Wind the thermocouple wire into loops and secure or if provided by the vendor

back onto the plastic roll (see Figure 54).

Figure 54. Finished Thermocouple Installation

39.

Place the device in a tray or bag until it’s ready to be used for thermal testing use.

D.6

Thermocouple Wire Management

When installing the processor into the socket, the thermocouple wire should route

under the socket lid, as shown in Figure 55. This will keep the wire from getting

damaged or pinched when removing and installing the heatsink.

Note:

When thermocouple wires are damaged, the resulting reading maybe wrong. For

example, if there are any cuts into the wires insulation where the wires are pinched

between the heatsink and the socket lid when installing the heatsink, the

thermocouple wires can get in contact at this location. In that case, the reported

temperature would be the point of the heatsink/socket lid area. This temperature is

usually much lower than the temperature at the center of the IHS.

Prior to installing the heatsink, make sure that the thermocouple wires remain below

the IHS top surface, by running a flat blade on top of the IHS for example.