Intel Q9450 Design Guidelines - Page 34
Processor Case Temperature Measurement, Guidelines
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3.4 Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at or below the thermal profile as listed in the datasheet. The measurement location for TC is the geometric center of the IHS. Figure 2 shows the location for TC measurement. Special care is required when measuring TC to ensure an accurate temperature measurement. Thermocouples are often used to measure TC. Before any temperature measurements are made, the thermocouples must be calibrated, and the complete measurement system must be routinely checked against known standards. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air, errors could be introduced in the measurements. The measurement errors could be caused by poor thermal contact between the junction of the thermocouple and the surface of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. Appendix D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for which it is intended. § 34 Thermal and Mechanical Design Guidelines