Intel Q9450 Design Guidelines - Page 14
Definition of Terms - socket
UPC - 735858198493
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Introduction 1.3 Definition of Terms Term ACPI BTX Bypass DTS FSC Health Monitor Component IHS LGA775 Socket PMAX PWM TA TC TCC TC-MAX TCONTROL TCONTROL_BASE TCONTROL_OFFSET TDIODE TDP TE Description Advanced Configuration and Power Interface. Balanced Technology Extended Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. Digital Thermal Sensor: Processor die sensor temperature defined as an offset from the onset of PROCHOT#. Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by a PWM signal and uses the digital thermal sensor as a reference to change the duty cycle of the PWM signal. Any standalone or integrated component that is capable of reading the processor temperature and providing the PWM signal to the 4 pin fan header. Integrated Heat Spreader: a thermally conductive lid integrated into a processor package to improve heat transfer to a thermal solution through heat spreading. The surface mount socket designed to accept the processors in the 775- Land LGA package. The maximum power dissipated by a semiconductor component. Pulse width modulation is a method of controlling a variable speed fan. The enabled 4 wire fans use the PWM duty cycle % from the fan speed controller to modulate the fan speed. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the processor, measured at the geometric center of the topside of the IHS. Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by lowering effective processor frequency when the die temperature has exceeded its operating limits. The maximum case temperature as specified in a component specification. TCONTROL is the specification limit for use with the digital thermal sensor. Constant from the processor datasheet that is added to the TCONTROL_OFFSET that results in the value for TCONTROL Value read by the BIOS from a processor MSR and added to the TCONTROL_BASE that results in the value for TCONTROL Temperature reported from the on-die thermal diode. Thermal Design Power: A power dissipation target based on worst-case applications. Thermal solutions should be designed to dissipate the thermal design power. The ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. 14 Thermal and Mechanical Design Guidelines