Intel Q9450 Design Guidelines - Page 17
Processor Thermal/Mechanical, Information
UPC - 735858198493
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Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in the center of the socket with solder balls for surface mounting to the motherboard. The socket is named LGA775 socket. A description of the socket can be found in the LGA775 Socket Mechanical Design Guide. The package includes an integrated heat spreader (IHS) that is shown in Figure 1 for illustration only. Refer to the processor datasheet for further information. In case of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in this document. Figure 1. Package IHS Load Areas Substrate Top Surface of IHS to install a heatsink IHS Step to inte rface w ith LGA775 Socket Load Plate Thermal and Mechanical Design Guidelines 17