Intel Q9450 Design Guidelines - Page 124

Intel® Enabled Reference Solution Information

124

Thermal and Mechanical Design Guidelines

Table 12. D60188-001 Reference Thermal Solution Providers

Supplier

Part Description

Supplier

P/N

Contact

Phone

Email

Foxconn*

Intel

®

D60188-001

Reference Solution

2ZR71-386

Wanchi

Chen

408-919-6135

Wanchi.Chen@Foxconn

.com

Fujikura*

Intel

®

D60188-001

Reference Solution

FHP-7543 Rev

A

Yuji Yasuda

408-988-7478

[email protected]

Nidec*

Intel

®

D60188-001

Reference Solution

F09A-12B1S2

01AC2H3(CX)

Motokazu

Nishimura

+81-75-935-

6480

MOTOKAZU_NISHIMUR

[email protected]

Sanyo

Denki*

Intel

®

D60188-001

Reference Solution

109X9212PT0

M036

Naoki

Maejima

+81-3-3917-

5157

naoki_maejima@sanyo

denki.co.jp

Foxconn*

Fastener

Base: C33389

Cap: C33390

Wanchi

Chen

408-919-6135

Wanchi.Chen@Foxconn

.com

ITW

Fastex*

Fastener

Base: C33389

Cap: C33390

Ron

Schmidt

847-299-2222

[email protected]

m

Note:

These vendors and devices are listed by Intel as a convenience to Intel's general

customer base, but Intel does not make any representations or warranties whatsoever

regarding quality, reliability, functionality, or compatibility of these devices. This list

and/or these devices may be subject to change without notice.

Table 13. Balanced Technology Extended (BTX) Thermal Solution Providers

Supplier

Part Description

Part Number

Contact

Phone

Notes

Mitac International

Corp

Support and

Retention Module

C54463-001

Michael

Tsai

886-3-328-

9000 Ext.6545

AVC*

(ASIA Vital

Components Co., Ltd)

Type I Thermal

Module Fan

Assembly

DB09238B12008

4

David Chao

+886-2-

22996930

Extension: 619

1

AVC*

(ASIA Vital

Components Co., Ltd)

Type II Thermal

Module Fan

Assembly

DB07038B12UP0

01

David Chao

+886-2-

22996930

Extension: 619

1

NOTE:

1.

The following for the 2004 Type I and Type II Intel reference Thermal Module

Assemblies: a) 2004 Type I TMA meets 2005 Performance and Mainstream Targets,

b) Type II does not meet 2005 Performance, however, meets 2005 Mainstream Targets

Note:

These vendors/devices are listed by Intel as a convenience to Intel's general customer

base, but Intel does not make any representations or warranties whatsoever regarding

quality, reliability, functionality, or compatibility of these devices. This list and/or

these devices may be subject to change without notice.

§

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9450 Design Guidelines - Page 124

Table 12. D60188-001 Reference Thermal Solution Providers, Table 13. Balanced Technology Extended

Page 124 highlights