Intel Q9450 Design Guidelines - Page 93
D.5.4, Cleaning and Completion of Thermocouple, Installation
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Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder. Figure 48. Removing Excess Solder 26. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time. Monitor the device IHS temperature with a handheld meter until it drops below 50° C before moving it to the microscope for the final steps. D.5.4 Cleaning and Completion of Thermocouple Installation 27. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with Tweezers, keeping the longest for re-use. 28. Straighten the wire and work the wire in to the groove. Bend the thermocouple over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS. Note: The wire needs to be straight so it doesn't sit above the IHS surface at anytime (see Figure 49). Thermal and Mechanical Design Guidelines 93