Intel Q9450 Design Guidelines - Page 13
References - power
UPC - 735858198493
View all Intel Q9450 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 13 highlights
Introduction 1.2 The physical dimensions and thermal specifications of the processor that are used in this document are for illustration only. Refer to the datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document. References Material and concepts available in the following documents may be beneficial when reading this document. Document Intel® Core™2 Extreme Quad-Core processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Datasheet Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000SSeries Datasheet Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide LGA775 Socket Mechanical Design Guide Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal Design Suggestions Balanced Technology Extended (BTX) System Design Guide Location http://developer.intel.com/desig n/processor/datashts/315592.ht m http://www.intel.com/design/pr ocessor/datashts/318726.htm www.intel.com/design/processo r/designex/318734.htm http://developer.intel.com/desig n/Pentium4/guides/302666.htm http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ Thermal and Mechanical Design Guidelines 13