Intel Q9450 Design Guidelines - Page 21

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

21

Figure 2. Processor Case Temperature Measurement Location

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

2.2.2

Thermal Profile

The Thermal Profile defines the maximum case temperature as a function of processor

power dissipation (refer to the datasheet for further information). The TDP and

Maximum Case Temperature are defined as the maximum values of the thermal

profile. By design the thermal solutions must meet the thermal profile for all system

operating conditions and processor power levels. Refer to the processor datasheet for

further information.

While the thermal profile provides flexibility for ATX /BTX thermal design based on its

intended target thermal environment, thermal solutions that are intended to function

in a multitude of systems and environments need to be designed for the worst-case

thermal environment. The majority of ATX /BTX platforms are targeted to function in

an environment that will have up to a 35 °C ambient temperature external to the

system.

For ATX platforms using the Intel

®

Core™2 Extreme quad-core processor QX6000

series at the 775_CONFIG_05B, an active air-cooled design in a Thermally Advantaged

Chassis, with a fan installed at the top of the heatsink equivalent to the RCFH-4

reference design (see Chapter

5) should be designed to manage the processor TDP at

an inlet temperature of 35 ºC + 4 ºC = 39 ºC.

Note:

Refer to

Thermally Advantaged Chassis version 1.1

for Thermally Advantaged Chassis

thermal and mechanical requirements.

For ATX platforms using the Intel

®

Core™2 Quad processor Q6000 series at 105 W, an

active air-cooled design in an ATX Chassis, with a fan installed at the top of the

heatsink equivalent to the RCBFH-3 reference design (see the document of

Intel

®

Pentium

®

4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and

Mechanical Design Guidelines

) should be designed to manage the processor TDP at an

inlet temperature of 35 ºC + 5 ºC = 40 ºC.

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9450 Design Guidelines - Page 21

Thermal Profile - quad core processor

Page 21 highlights