Intel S1200RP Technical Product Specification - Page 11

Intel® Server System R1000RP Family TPS Introduction 1. Introduction This Technical Product Specification (TPS) provides system specific information detailing the features, functionality, and high-level architecture of the Intel® Server System R1000RP family. You can also reference the Intel® Server Board S1200V3RP Family Technical Product Specification to obtain greater detail of functionality and architecture of the server board integrated in this server system. In addition, you can obtain design-level information for specific subsystems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel and must be ordered through your local Intel representative. For a complete list of available documents, refer to the Reference Documents section at the end of this document. The Intel® Server System R1000RP may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Refer to the Intel® Server Board S1200V3RP / Intel® Server System R1000RP Specification Update for published errata. 1.1 Chapter Outline This document is divided into the following chapters:  Chapter 1 - Introduction  Chapter 2 - Product Overview  Chapter 3 - Power Subsystem  Chapter 4 - Thermal Management  Chapter 5 - System Storage and Peripheral Options  Chapter 6 - Storage Controller Options Overview  Chapter 7 - Front Control Panel and I/O Panel Overview  Chapter 8 - Intel® Local Control Panel  Chapter 9 - PCIe Support and Riser Card Support  Appendix A - Integration and Usage Tips  Appendix B - POST Code LED Decoder  Appendix C - POST Code Errors  Glossary  Reference Documents 1.2 Server Board Use Disclaimer Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.2 Intel order number: G91532-003 1