Intel S1200RP Technical Product Specification - Page 82

Intel® Server System R1000RP Family TPS Reference Documents Reference Documents Refer to the following documents for additional information:  Intel® Server Board S1200V3RP Technical Product Specification  ACPI 3.0: http://www.acpi.info/spec.htm  IPMI 2.0  Data Center Management Interface Specification v1.0, May 1, 2008: www.intel.com/go/dcmi  PCI Bus Power Management Interface Specification 1.1: http://www.pcisig.com/  PCI Express* Base Specification Rev 2.0, Dec 06: http://www.pcisig.com/  PCI Express* Card Electromechanical Specification, Rev 2.0: http://www.pcisig.com/  PMBus*: http://pmbus.org  SATA 2.6: http://www.sata-io.org/  SMBIOS 2.4  SSI-EEB 3.0: http://www.ssiforum.org/  USB 1.1: http://www.usb.org  USB 2.0: http://www.usb.org  Windows* Logo/SDG 3.0  Intel® Dynamic Power Technology Node Manager 1.5 External Interface Specification using IPMI, 2007. Intel Corporation.  Node Power and Thermal Management Architecture Specification v1.5, rev.0.79. 2007, Intel Corporation.  Intel® Server System Integrated Baseboard Management Controller Core External Product Specification, 2007 Intel Corporation.  Intel® Thurley Server Platform Services IPMI Commands Specification, 2007. Intel Corporation.  Intel® Server Safety and Regulatory, 2012. Intel Corporation. (Intel® Order Code: G23122)  Intelligent Platform Management Bus Communications Protocol Specification, Version 1.0, 1998. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation, Dell* Computer Corporation.  Platform Environmental Control Interface (PECI) Specification, Version 2.0. Intel Corporation.  Platform Management FRU Information Storage Definition, Version 1.0, Revision 1.2, 2002. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation, Dell* Computer Corporation: http://developer.intel.com/design/servers/ipmi/spec.htm. 72 Intel order number: G91532-003 Revision 1.2