Intel S1200RP Technical Product Specification - Page 38

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Thermal Management Intel® Server System R1000RP Family TPS 4 Thermal Management The fully integrated system is designed to operate at external ambient temperatures of between 10ºC and 35ºC with limited excursion based operation up to 35ºC. Working with integrated platform management, several features within the system are designed to move air in a front to back direction, through the system and over critical components in order to prevent them from overheating and allow the system to operate with best performance. The Intel® Server System R1000RP product family supports short-term, excursion-based, operation up to 35°C (ASHRAE A2) with limited performance impact. The configuration requirements and limitations are described in the configuration matrix found in the Intel® S1200V3RP Product Family Power Budget and Thermal Configuration Tool, available to download online at http://www.intel.com/p/en_US/support. The installation and functionality of several system components are used to maintain system thermals. 4.1 Thermal Operation and Configuration Requirements To keep the system operating within supported maximum thermal limits, the system must meet the following operating and configuration guidelines:  The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE Class A2). o When operating within the extended operating temperature range, the system performance may be impacted. o There is no long term system reliability impact when operating at the extended temperature range within the approved limits.  Specific configuration requirements and limitations are documented in the configuration matrix found in the Intel® Server Board S1200V3RP product family Power Budget and Thermal Configuration Guidelines Tool, available to download online at http://www.intel.com/p/en_US/support.  The processor and the CPU heatsink must be installed first.  Memory Slot population requirements Note: Specified memory slots can be populated with a DIMM or supplied DIMM Blank. Memory population rules apply when installing DIMMs. Install DIMMs in the order; Channels A, then Channels B. Start with the first DIMM (Blue Slot) on each channel, then slot 2. Only remove factory installed DIMM blanks when populating the slot with an actual memory module.  All hard drive bays must be populated. Hard drive carriers can be populated with a hard drive or supplied drive blank.  In single power supply configurations, the second power supply bay must have the supplied filler blank installed at all times.  The system top-cover must be installed at all times. 28 Intel order number: G91532-003 Revision 1.2

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Thermal Management
Intel
®
Server System R1000RP Family TPS
Intel
order number: G91532-003
Revision 1.2
28
4
Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between
10ºC and 35ºC with limited excursion based operation up to 35ºC. Working with integrated
platform management, several features within the system are designed to move air in a front to
back direction, through the system and over critical components in order to prevent them from
overheating and allow the system to operate with best performance.
The Intel
®
Server System R1000RP product family supports short-term, excursion-based,
operation up to 35°C (ASHRAE A2) with limited performance impact. The configuration
requirements and limitations are described in the configuration matrix found in the
Intel
®
S1200V3RP Product Family Power Budget and Thermal Configuration Tool
, available to
download online at
.
The installation and functionality of several system components are used to maintain system
thermals.
4.1
Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:
The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2).
o
When operating within the extended operating temperature range, the system
performance may be impacted.
o
There is no long term system reliability impact when operating at the extended
temperature range within the approved limits.
Specific configuration requirements and limitations are documented in the configuration
matrix found in the
Intel
®
Server Board S1200V3RP product family
Power Budget and
Thermal Configuration Guidelines Tool,
available to download online at
.
The processor and the CPU heatsink must be installed first.
Memory Slot population requirements
Note:
Specified memory slots can be populated with a DIMM or supplied DIMM Blank.
Memory population rules apply when installing DIMMs. Install DIMMs in the order;
Channels A, then Channels B. Start with the first DIMM (Blue Slot) on each channel,
then slot 2. Only remove factory installed DIMM blanks when populating the slot with an
actual memory module.
All hard drive bays must be populated. Hard drive carriers can be populated with a hard
drive or supplied drive blank.
In single power supply configurations, the second power supply bay must have the
supplied filler blank installed at all times.
The system top-cover must be installed at all times.