Intel S1200RP Technical Product Specification - Page 39

Intel

®

Server System R1000RP Family TPS

Thermal Management

Revision 1.2

Intel

order number: G91532-003

29

4.2

Thermal Management Overview

In order to maintain the necessary airflow within the system, all of the previously listed

components and top cover need to be properly installed. For best system performance, the

external ambient temperature should remain below 35ºC and all system fans should be

operational. The system is designed for fan redundancy when the system is configured with two

power supplies. If a single system fan fails (System fan or Power Supply Fan), integrated

platform management will change the state of the System Status LED to flashing Green, report

an error to the system event log, and automatically adjust fan speeds as needed to maintain

system temperatures below maximum thermal limits.

Note:

All system fans are controlled independently of each other. The fan control system may

adjust fan speeds for different fans based on increasing/decreasing temperatures in different

thermal zones within the chassis.

In the event that system thermals should continue to increase with the system fans operating at

their maximum speed, platform management may begin to throttle bandwidth of either the

memory subsystem or the processors or both, in order to keep components from overheating

and keep the system operational. Throttling of these subsystems will continue until system

thermals are reduced below preprogrammed limits.

If system temperatures increase to a point beyond the maximum thermal limits, the system will

shut down, the System Status LED will change to a solid Amber state, and the event will be

logged to the system event log.

Note:

Sensor data records (SDRs) for any given system configuration must be loaded by the

system integrator for proper thermal management of the system. SDRs are loaded using the

FRUSDR utility.

An intelligent Fan Speed Control (FSC) and thermal management technology (mechanism) is

used to maintain comprehensive thermal protection, deliver the best system acoustics, and

improves fan power efficiency. Options in <

F2

> BIOS Setup (

BIOS

>

Advanced

>

System

Acoustic and Performance Configuration

) allow for parameter adjustments based on the

actual system configuration and usage. Refer to the following sections for a description of each

setting.

4.2.1

Set Throttling Mode

This option is used to select the desired memory thermal throttling mechanism. Available

settings include [Auto], [CLTM], and [OLTM].

[Auto]

–

Factory Default Setting: BIOS automatically detects and identifies the appropriate

thermal throttling mechanism based on the DIMM type, airflow input, and DIMM sensor

availability.

[CLTM]

–

Closed Loop Thermal Management: Would be used with an OEM chassis and DIMMs

with TSOD. The firmware does not change the offset registers for closed loop during runtime,

although the Management Engine can do so.

[OLTM]

–

Open Loop Thermal Management: Is intended for a system with UDIMMs which do

not have TSOD. The thermal control registers are configured during POST, and the firmware

Section	Page
1. Introduction	11
1.1 Chapter Outline	11
1.2 Server Board Use Disclaimer	11
2. Product Overview	12
2.1 System Views	14
2.2 System Dimensions	15
2.3 System Level Environmental Limits	15
2.4 System Features and Options Overview	17
2.4.1 Hot Swap Hard Drive Bay and Front Panel Options	17
2.4.2 Back Panel Features	18
2.4.3 Front Control Panel Options	18
2.5 Server Board Overview	19
2.5.1 Rear Component View	21
2.6 Available Front Bezel Support (Optional)	21
2.7 Available Rack and Cabinet Mounting Kit Options	22
3. Power Subsystem	23
3.1 350W Fixed Power Supply	23
3.1.1 Mechnical Overview	23
3.1.2 Power Supply Module Efficiency	24
3.1.3 Power Cord Specification Requirements	24
3.1.4 AC Input Requirement	25
3.1.4.1 Power Factor	25
3.1.4.2 AC Input Voltage Specification	25
3.1.4.3 AC Line Isolation Requirements	25
3.1.4.4 AC Line Dropout/Holdup	26
3.1.4.5 AC Line Fuse	26
3.1.4.6 AC Inrush	26
3.1.4.7 AC Line Leakage Current	26
3.1.4.8 AC Line Transient Specification	26
3.1.4.9 Susceptibility Requirements	27
3.1.4.10 Electrostatic Discharge Susceptibility	27
3.1.4.11 Fast Transient/Burst	27
3.1.4.12 Radiated Immunity	27
3.1.4.13 Surge Immunity	28
3.1.4.14 Power Recovery	28
3.1.4.15 Voltage Interruptions	28
3.1.5 DC Output Specification	28
3.1.5.1 Output Power/Currents	28
3.1.5.2 Standby Output	28
3.1.6 Protection Circuits	28
3.1.6.1 Over Current Protection (OCP)	29
3.1.6.2 Over Voltage Protection (OVP)	29
3.1.6.3 Over Temperature Protection (OTP)	29
3.2 450W mini-ERPS Redundant Power Supply	29
3.2.1 Mechnical Overview	30
3.2.2 Power Supply Module Card Edge Connector	31
3.2.3 Power Supply Module Efficiency	32
3.2.4 Power Cord Specification Requirements	32
3.2.5 AC Input Requirement	32
3.2.5.1 Power Factor	32
3.2.5.2 AC Input Voltage Specification	32
3.2.5.3 AC Line Isolation Requirements	33
3.2.5.4 AC Line Dropout/Holdup	33
3.2.5.5 AC Line Fuse	33
3.2.5.6 AC Inrush	34
3.2.5.7 AC Line Leakage Current	34
3.2.5.8 AC Line Transient Specification	34
3.2.5.9 Susceptibility Requirements	34
3.2.5.10 Electrostatic Discharge Susceptibility	35
3.2.5.11 Fast Transient/Burst	35
3.2.5.12 Radiated Immunity	35
3.2.5.13 Surge Immunity	35
3.2.5.14 Power Recovery	35
3.2.5.15 Voltage Interruptions	35
3.2.6 DC Output Specification	36
3.2.6.1 Output Power/Currents	36
3.2.6.2 Standby Output	36
3.2.7 Protection Circuits	36
3.2.7.1 Current Limit (OCP)	36
3.2.7.2 Over Voltage Protection (OVP)	37
3.2.7.3 Over Temperature Protection (OTP)	37
4 Thermal Management	38
4.1 Thermal Operation and Configuration Requirements	38
4.2 Thermal Management Overview	39
4.2.1 Set Throttling Mode	39
4.2.2 Altitude	40
4.2.3 Set Fan Profile	40
4.2.4 Fan PWM Offset	40
4.2.5 Quiet Fan Idle Mode	40
4.2.6 Thermal Sensor Input for Fan Speed Control	40
4.3 System Fans	42
4.4 FRUSDR Utility	44
5 System Storage and Peripheral Options	45
5.1 2.5” Hard Disk Drive Support	45
5.1.1 2.5” Drive Hot-Swap Backplane Overview	46
5.1.2 Cypress* CY8C22545 Enclosure Management Controller	47
5.2 3.5” Hard Disk Drive Support	47
5.2.1 3.5” Drive Hot-Swap Backplane Overview	48
5.2.2 Cypress* CY8C22545 Enclosure Management Controller	49
5.3 SATA DOM Support	49
6 Storage Controller Options Overview	50
6.1 Embedded SATA Controller Support	50
7 Front Control Panel and I/O Panel Overview	51
7.1 I/O Panel Features	51
7.2 Control Panel Features	51
8 Intel® Local Control Panel	56
8.1 LCD Functionality	56
8.2 Main Menu	57
8.3 Event Menu	58
8.4 View Menu	58
8.4.1 System FW Version (SysFwVer)	58
8.4.2 System Information (SysInfo)	59
8.4.3 BMC IP Configuration	59
8.4.4 RMM4 IP Configuration	59
8.4.5 Power	60
8.4.6 Last Post Code (Last PC)	60
8.5 Config Menu	60
8.5.1 IP Version	60
8.5.2 BMC IP	60
8.5.3 RMM4 IP	62
8.5.4 Boot Device	62
8.5.5 Banner	62
9 PCIe Support and Riser Card Support	64
9.1 Architectural Overview of the Server Board Riser Slots	64
Appendix A: Integration and Usage Tips	67
Appendix B: POST Code LED Decoder	68
Appendix C: POST Code Errors	73
Glossary	79

Intel S1200RP Technical Product Specification - Page 39

Thermal Management Overview

Page 39 highlights