HP EliteBook 2170p HP EliteBook 2170p Notebook PC Maintenance and Service Guid - Page 86

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and, detach it.

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g. Base enclosure (see Base enclosure on page 63) h. System board (see System board on page 75) Remove the heat sink: 1. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (1) that secure the heat sink to the system board. 2. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. 78 Chapter 4 Removal and replacement procedures

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g.
Base enclosure (see
Base enclosure
on page
63
)
h.
System board (see
System board
on page
75
)
Remove the heat sink:
1.
Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws
(1)
that secure the heat sink to the system board.
2.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink and system board spare part kits. Thermal paste is used on the
processor
(1)
and the heat sink section
(2)
that services it.
78
Chapter 4
Removal and replacement procedures