HP Pavilion m7-1000 HP Pavilion dv7 Entertainment PC - Maintenance and Service - Page 88

Thermal paste is used on the graphics subsystem chip, that services

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NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it ● Thermal pads are used on the system board components (5) and the heat sink sections (6) that service them 80 Chapter 4 Removal and replacement procedures

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NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste
is used on the processor
(1)
and the heat sink section
(2)
that services it.
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
●
Thermal pads are used on the system board components
(5)
and the heat sink sections
(6)
that
service them
80
Chapter 4
Removal and replacement procedures