Dell PowerEdge R760 Installation and Service Manual - Page 45

Table 35. Thermal restriction matrix for GPU configurations continued

Page 45 highlights

Table 35. Thermal restriction matrix for GPU configurations (continued) Configuration No backplane 8 x 2.5inch NVMe 8 x 2.5inch NVMe + 8 x 2.5inch SAS 16 x 2.5inch SAS 16 x 2.5inch NVMe 24 x 2.5inch SAS Rear storage No rear drives No rear No rear No rear drives drives drives No rear drives No rear drives CPU TDP/ cTDP T-Case max center (°C) HPR GOLD fan with 1U HPR L-Type HSK 350 W 57/66 Required DLC Required Required Required DLC DLC DLC Required DLC Required DLC 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe No rear drives No rear drives Required Required DLC DLC Table 36. GPU type support thermal restriction for both Air cooling and Liquid cooling configuration Configuratio n 8 x 2.5-inch NVMe 16 x 2.5-inch SAS and split NVMe-SAS 16 x 2.5-inch NVMe 24 x 2.5-inch SAS 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe Rear storage No rear drives No rear drives No rear drives No rear drives No rear drives No rear drives GPU HPR GOLD fan with 1U HPR L-Type HSK A40 (Max 2) 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F) 30°C (86°F) 30°C (86°F) A100 80 GB (Max 2) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) A16 (Max 2) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) A30 (Max 2) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) A2 (Max 6) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) H100 (Max 2) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) A800 (Max 2) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) Table 37. Thermal restriction matrix for memory with air cooled configuration (GPU) Configuration No backplane 8 x 2.5-inch NVMe 16 x 2.5inch SAS* 16 x 2.5inch NVMe** 24 x 2.5-inch SAS* 16 x 2.5inch SAS + 8 x 2.5- inch NVMe*** 24 x 2.5inch NVMe*** DIMM Configura tion 2DPC/ Power HPR GOLD fan with 1U HPR L-Type HSK 256 GB RDIMM 12.7 W 30°C (86°F) 30°C (86°F) 30°C (86°F) 30°C (86°F) Required DLC Required Required DLC DLC 128 GB RDIMM 8.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 64 GB RDIMM 6.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 32 GB RDIMM 4.1 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 16 GB 3 W 35°C 35°C (95°F) 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) RDIMM (95°F) (95°F) (95°F) (95°F) NOTE: *In 16 x 2.5-inch SAS and 8 x 2.5-inch NVMe configurations, for CPU TDP 350 W supported ambient temperature is 30°C (86°F). Technical specifications 45

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Table 35. Thermal restriction matrix for GPU configurations (continued)
Configuration
No
backplane
8 x 2.5-
inch
NVMe
8 x 2.5-
inch
NVMe +
8 x 2.5-
inch SAS
16 x 2.5-
inch SAS
16 x 2.5-
inch NVMe
24 x 2.5-
inch SAS
16 x 2.5-
inch SAS +
8 x 2.5-
inch NVMe
24 x 2.5-
inch
NVMe
Rear storage
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
CPU
TDP/
cTDP
T-Case
max
center
(°C)
HPR GOLD fan with 1U HPR L-Type HSK
350 W
57/66
Required
DLC
Required
DLC
Required
DLC
Required
DLC
Required
DLC
Required
DLC
Required
DLC
Required
DLC
Table 36. GPU type support thermal restriction for both Air cooling and Liquid cooling configuration
Configuratio
n
8 x 2.5-inch
NVMe
16 x 2.5-inch
SAS and split
NVMe-SAS
16 x 2.5-inch
NVMe
24 x 2.5-inch
SAS
16 x 2.5-inch
SAS + 8 x
2.5-inch
NVMe
24 x 2.5-inch
NVMe
Rear storage
No rear drives
No rear
drives
No rear
drives
No rear drives
No rear
drives
No rear drives
GPU
HPR GOLD fan with 1U HPR L-Type HSK
A40 (Max 2)
35°C (95°F)
35°C (95°F)
30°C (86°F)
30°C (86°F)
30°C (86°F)
30°C (86°F)
A100 80 GB
(Max 2)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
A16 (Max 2)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
A30 (Max 2)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
A2 (Max 6)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
H100 (Max 2)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
A800 (Max 2)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
Table 37. Thermal restriction matrix for memory with air cooled configuration (GPU)
Configuration
No
backplane
8 x 2.5-inch
NVMe
16 x 2.5-
inch SAS*
16 x 2.5-
inch
NVMe**
24 x 2.5-inch
SAS*
16 x 2.5-
inch SAS
+ 8 x 2.5-
inch
NVMe***
24 x 2.5-
inch
NVMe***
DIMM
Configura
tion
2DPC/
Power
HPR GOLD fan with 1U HPR L-Type HSK
256 GB
RDIMM
12.7 W
30°C
(86°F)
30°C (86°F)
30°C
(86°F)
30°C
(86°F)
Required DLC
Required
DLC
Required DLC
128 GB
RDIMM
8.9 W
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C (95°F)
64 GB
RDIMM
6.9 W
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C (95°F)
32 GB
RDIMM
4.1 W
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C (95°F)
16 GB
RDIMM
3 W
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C
(95°F)
35°C (95°F)
35°C
(95°F)
35°C (95°F)
NOTE:
*In 16 x 2.5-inch SAS and 8 x 2.5-inch NVMe configurations, for CPU TDP 350 W supported ambient temperature is
30°C (86°F).
Technical specifications
45