Intel D101GGC Product Specification - Page 52

Reliability

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Intel Desktop Board D101GGC Technical Product Specification Table 31 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 31. Thermal Considerations for Components Component Intel Pentium 4 processor ATI Radeon Xpress 200 Northbridge IXP 450 Southbridge Maximum Case Temperature For processor case temperature, see processor datasheets and processor specification updates 95 oC 85 oC For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.2, page 14 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D101GGC board is 95,006 hours. 52

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Intel Desktop Board D101GGC Technical Product Specification
52
Table 31 provides maximum case temperatures for the components that are sensitive to thermal
changes.
The operating temperature, current load, or operating frequency could affect case
temperatures.
Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 31.
Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Pentium 4 processor
For processor case temperature, see processor datasheets and
processor specification updates
ATI Radeon Xpress 200 Northbridge
95
o
C
IXP 450 Southbridge
85
o
C
For information about
Refer to
Intel Pentium 4 processor datasheets and specification updates
Section 1.2, page 14
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
The MTBF for the D101GGC board is
95,006 hours.