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Intel D101GGC Product Specification - Page 58

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Intel Desktop Board D101GGC Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı'nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Web sayfasına gidin. 2.14.3.3 Lead Free Desktop Board The desktop board is lead free. Other box contents may contain lead. Table 34. Lead Free Desktop Board Description Lead-Free: The symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm). This symbol is also used to indicate conformance to lead-free requirements and definitions adopted under the European Union's Restriction on Hazardous Substances (RoHS) directive, 2002/95/EC. Mark 58

Section	Page
Intel® Desktop Board D101GGC Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Block Diagram	11
1.1.3 Board Layout	12
1.2 Online Support	14
1.3 Processor	14
1.4 System Memory	15
1.5 ATI Radeon* Xpress 200 Chipset	16
1.5.1 RC410 Graphics Subsystem	16
1.5.2 Firmware Hub (FWH)	16
1.5.3 USB	16
1.5.4 IDE Support	17
1.5.5 Real-Time Clock, CMOS SRAM, and Battery	18
1.6 PCI Express* Connectors	18
1.7 Legacy I/O Controller	19
1.7.1 Serial Port	19
1.7.2 Parallel Port	19
1.7.3 Diskette Drive Controller	19
1.7.4 Keyboard and Mouse Interface	19
1.8 High Definition Audio Subsystem	20
1.8.1 Audio Subsystem Software	20
1.8.2 Audio Connectors	21
1.9 LAN Subsystem	22
1.9.1 LAN Subsystem Software	22
1.10 Hardware Management Subsystem	23
1.10.1 Fan Monitoring	23
1.10.2 Chassis Intrusion and Detection	23
1.11 Power Management	23
1.11.1 ACPI	24
1.11.2 Hardware Support	26
2 Technical Reference	31
2.1 Memory Map	31
2.2 DMA Channels	32
2.3 Fixed I/O Map	33
2.4 Interrupts	34
2.5 PCI Configuration Space Map	35
2.6 PCI Conventional Interrupt Routing Map	35
2.7 Connectors	36
2.7.1 Back Panel Connectors	37
2.7.2 Component-side Connectors	38
2.7.3 Front Panel USB Connectors	44
2.8 Jumper Block	45
2.9 Mechanical Considerations	46
2.9.1 Form Factor	46
2.9.2 I/O Shield	47
2.10 Electrical Considerations	48
2.10.1 DC Loading	48
2.10.2 Add-in Board Considerations	48
2.10.3 Fan Connector Current Capability	49
2.10.4 Power Supply Considerations	49
2.11 Thermal Considerations	50
2.12 Reliability	52
2.13 Environmental	53
2.14 Regulatory Compliance	54
2.14.1 Safety Regulations	54
2.14.2 European Union Declaration of Conformity Statement	54
2.14.3 Product Ecology Statements	56
2.14.4 EMC Regulations	59
2.14.5 Product Certification Markings (Board Level)	60
3 Overview of BIOS Features	61
3.1 Introduction	61
3.2 BIOS Flash Memory Organization	62
3.3 Resource Configuration	62
3.3.1 PCI Autoconfiguration	62
3.3.2 PCI IDE Support	62
3.4 System Management BIOS (SMBIOS)	63
3.5 Legacy USB Support	63
3.6 BIOS Updates	64
3.6.1 Language Support	64
3.6.2 Custom Splash Screen	64
3.7 Boot Options	65
3.7.1 CD-ROM Boot	65
3.7.2 Network Boot	65
3.7.3 Booting Without Attached Devices	65
3.7.4 Changing the Default Boot Device During POST	65
3.8 Adjusting Boot Speed	66
3.8.1 Peripheral Selection and Configuration	66
3.8.2 BIOS Boot Optimizations	66
3.9 BIOS Security Features	67
4 Error Messages and Beep Codes	69
4.1 Speaker	69
4.2 BIOS Beep Code	69
4.3 BIOS Error Messages	69