Intel X5365 Design Guide - Page 11

Table 1-2., Terms and Descriptions Sheet 2 of 2 - xeon processor

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Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) TCASE_MAX TCC TCONTROL TOFFSET TDP Thermal Monitor Thermal Profile TIM TLA TSA U The maximum case temperature as specified in a component specification. Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. A processor unique value for use in fan speed control mechanisms. TCONTROL is a temperature specification based on a temperature reading from the processor's Digital Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control implementation. TCONTROL = -TOFFSET. An offset value from the TCC activation temperature value specified in the processor data sheet and TCONTROL =-TOFFSET. This value is programmed into each processor during manufacturing and can be obtained by reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG). Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. A feature on the processor that can keep the processor's die temperature within factory specifications under normal operating conditions, and with a thermal solution that satisfies the processor thermal profile specification. Line that defines case temperature specification of a processor at a given power level. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11

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Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
11
Introduction
§
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
T
CONTROL
A processor unique value for use in fan speed control mechanisms. T
CONTROL
is a
temperature specification based on a temperature reading from the processor’s Digital
Thermal Sensor. T
CONTROL
can be described as a trigger point for fan speed control
implementation. T
CONTROL
= -T
OFFSET
.
T
OFFSET
An offset value from the TCC activation temperature value specified in the processor
data sheet and T
CONTROL
=-T
OFFSET
. This value is programmed into each processor
during manufacturing and can be obtained by reading the
IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the
Conroe and Woodcrest Processor Family BIOS Writer’s Guide (BWG)
.
TDP
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor
A feature on the processor that can keep the processor’s die temperature within factory
specifications under normal operating conditions, and with a thermal solution that
satisfies the processor thermal profile specification.
Thermal Profile
Line that defines case temperature specification of a processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)