Intel X5365 Design Guide - Page 52

Thermal/Mechanical Reference Design

52

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Clearance is required around the heatsink to ensure unimpeded airflow for proper

cooling. The physical baseboard keepout requirements for the active solution are the

same as the passive CEK solution shown in

Appendix B

. Refer to

Figure B-18

through

Figure B-20

for additional details on the active CEK thermal solution volumetrics.

2.4.8.1

Fan Power Supply

The active heatsink includes a fan, which requires a +12 V power supply. Platforms

must provide a matched fan power header to support the boxed processor.

Table 2-10

contains specifications for the input and output signals at the heatsink fan connector.

The fan outputs a SENSE signal, an open-collector output, which pulses at a rate of two

pulses per fan revolution. A baseboard pull-up resistor provides VCC to match the

baseboard-mounted fan speed monitor requirements, if applicable. Use of the SENSE

signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied

to GND.

It is recommended that a 4 pin fan header be used on the baseboard, in addition to, a

control ASIC that can send a PWM signal to the active fan heatsink solution on the

4

th

pin, at a nominal 25 KHz frequency. If a 3-pin CPU fan header is used instead, the

active fan heatsink solution will revert back to an automatic ambient air temperature

control mode.

The fan power header on the baseboard must be positioned to allow the fan heatsink

power cable to reach it. The fan power header identification and location must be

documented in the supplier’s platform documentation, or on the baseboard itself. The

baseboard fan power header should be positioned within 177.8 mm [7 in.] from the

center of the processor socket.

Note:

System board should pull this pin up to V

CC

with a resistor.

Table 2-10.

Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution)

Description

Min

Typ

Steady

Max

Steady

Max

Startup

Unit

Notes

+12V: 12 Volt Fan Power

Supply

10.8

12

12

13.2

V

IC: Fan Current Draw

N/A

1.25

1.5

1.5

A

SENSE: SENSE Frequency

2

2

2

2

Pulses per fan revolution

1

Figure 2-28. Fan Cable Connection (Active CEK)

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 52

Fan Power Supply, Table 2-10., Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution - xeon cpu

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