Intel X5365 Design Guide - Page 42

Thermal/Mechanical Reference Design

42

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

for structural support and stiffening on the chassis. Intel has published a best known

method (BKM) document that provides specific structural guidance for designing DCA

thermal solutions. The document is titled

Chassis Strength and Stiffness Measurement

and Improvement Guidelines for Direct Chassis Attach Solutions

.

2.4.5

Thermal Solution Performance Characteristics

Figure 2-17

and

Figure 2-18

show the performance of the 2U+ and 1U passive

heatsinks, respectively. These figures show the thermal performance and the pressure

drop through fins of the heatsink versus the airflow provided. The best-fit equations for

these curves are also provided to make it easier for users to determine the desired

value without any error associated with reading the graph.

If other custom heatsinks are intended for use with the Quad-Core Intel® Xeon®

Processor 5300 Series, they must support the following interface control requirements

to be compatible with the reference mechanical components:

•

Requirement 1:

Heatsink assembly must stay within the volumetric keep-in.

•

Requirement 2:

Maximum mass and center of gravity.

Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of

gravity 3.81 cm [1.5 in.] above the bottom of the heatsink base.

•

Requirement 3:

Maximum and minimum compressive load.

Any custom thermal solution design must meet the loading specification as

documented within this document, and should refer to the

Quad-Core Intel® Xeon®

Processor 5300 Series Datasheet

and

LGA771 Socket Mechanical Design Guide

and for

specific details on package/socket loading specifications.

Figure 2-17. 2U+ CEK Heatsink Thermal Performance

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 42

Thermal Solution Performance Characteristics, U+ CEK Heatsink Thermal Performance

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