Intel X5365 Design Guide - Page 44

Equation 2-9.y = 0.249x + 40

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Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A 65 TCASE_MAX_A@TDP Temperature ( C ) 60 55 50 TCASE_MAX_A @ P _PROFILE_MIN_A 45 Thermal Profile A Y = 0.171 * X + 42.5 2U+ CEK Reference Solution Y = 0.190 * X + 40 40 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 90 100 110 120 P_PROFILE_MIN_A Power (W) TDP The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5300 Series. From Table 2-4 the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.249 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation 2-9.y = 0.249x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-20 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B specification. The 1U CEK solution meets the Thermal Profile B with 2.3°C margin at the lower end (P_PROFILE_MIN) and 0.1 °C margin at the upper end (TDP). However, as explained in Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and measurable performance loss for the processor. 44 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

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Thermal/Mechanical Reference Design
44
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Quad-Core Intel® Xeon® Processor X5300 Series. From
Table 2-4
the three-
sigma (mean+3sigma) performance of the thermal solution is computed to be
0.249 °C/W and the processor local ambient temperature (T
LA
) for this thermal solution
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-9.y = 0.249x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-20
below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B
specification. The 1U CEK solution meets the Thermal Profile B with 2.3°C margin at
the lower end (P
_PROFILE_MIN
) and 0.1 °C margin at the upper end (TDP). However, as
explained in
Section 2.2.7
, designing to Thermal Profile B results in increased TCC
activation and measurable performance loss for the processor.
Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300
Series Thermal Profile A
40
45
50
55
60
65
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power (W)
Temperature (
C
)
T
CASE_MAX_A
@ TDP
2U+ CEK Reference Solution
Y = 0.190 * X + 40
Thermal Profile A
Y = 0.171 * X + 42.5
T
CASE_MAX_A
@ P
90
100
110
_PROFILE_MIN_A
P
_PROFILE_MIN_A
TDP
120